Inventor · disambiguated record
Mike Gruenhagen
Also filed as: GRUENHAGEN MIKE · GRUENHAGEN MIKE D
0 granted patents·3 pending applications·0 citations·filing 2007–2010
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0142US2008054461A1Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor deviceLANG DENNIS·Filed 2007·Application pending·0 cites
- 0241US2011031596A1Nickel-titanum soldering layers in semiconductor devicesGRUENHAGEN MIKE D·Filed 2009·Application pending·0 cites
- 0334US2010117231A1Reliable wafer-level chip-scale solder bump structureLANG DENNIS·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →