Inventor · disambiguated record
Michael Guenther
Also filed as: GUENTHER MICHAEL · GUENTHER MICHAEL RAYMOND
10 granted patents·6 pending applications·50 citations·filing 1980–2024
84Inventor score
Files withBOSCH GMBH ROBERT6RITTNER MARTIN2DAIMLER BENZ AG1GUENTHER MICHAEL RAYMOND1GUYENOT MICHAEL1
Top patents by PatentIndex Score
16 records- 0174US8730676B2Composite component and method for producing a composite componentHIRSCH MICHELE·Filed 2010·Granted May 20, 2014·6 cites·14 claims
- 0268US7887236B2X-ray source for a mobile X-ray diagnostic unit with a C-armZIEHM IMAGING GMBH·Filed 2008·Granted Feb 15, 2011·8 cites·20 claims
- 0365US10653275B2Tuna press strainerGUENTHER MICHAEL RAYMOND·Filed 2018·Granted May 19, 2020·1 cites·3 claims
- 0462US12425013B1Implementing optimal coarse programmable delay setting in skew adjust closed loop controlIBM·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0561US4863599AFilter arrangementDAIMLER BENZ AG·Filed 1987·Granted Sep 5, 1989·20 cites·4 claims
- 0658US4369709AUnderwater detonating deviceRHEINMETALL GMBH·Filed 1980·Granted Jan 25, 1983·15 cites·35 claims
- 0741US9502634B2Piezoelectric component and method for producing a piezoelectric componentBOSCH GMBH ROBERT·Filed 2014·Granted Nov 22, 2016·0 cites·10 claims
- 0840US2011304985A1Electrical or electronic composite component and method for producing an electrical or electronic composite componentRITTNER MARTIN·Filed 2009·Application pending·0 cites
- 0937US9630379B2Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solderBOSCH GMBH ROBERT·Filed 2012·Granted Apr 25, 2017·0 cites·14 claims
- 1036US2012028025A1Electrical or electronic composite component and method for producing an electrical or electronic composite componentWOLDE-GIORGIS DANIEL·Filed 2009·Application pending·0 cites
- 1134US2012003465A1Sintering material, sintered bond and method for producing a sintered bondRITTNER MARTIN·Filed 2010·Application pending·0 cites
- 1232US9887173B2Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layerGUYENOT MICHAEL·Filed 2012·Granted Feb 6, 2018·0 cites·16 claims
- 1332US2015306669A1Method for connecting at least two components using a sintering processBOSCH GMBH ROBERT·Filed 2013·Application pending·0 cites
- 1432US2014234649A1Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layerBOSCH GMBH ROBERT·Filed 2012·Application pending·0 cites
- 1530US2015123263A1Two-step method for joining a semiconductor to a substrate with connecting material based on silverBOSCH GMBH ROBERT·Filed 2013·Application pending·0 cites
- 1629US9871025B2Commutation cellBOSCH GMBH ROBERT·Filed 2015·Granted Jan 16, 2018·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →