Inventor · disambiguated record
Min Chan Gwak
Also filed as: GWAK MIN CHAN
13 granted patents·6 pending applications·13 citations·filing 2018–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD19
Top patents by PatentIndex Score
19 records- 0190US10340219B2Semiconductor device having a metal viaSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 2, 2019·7 cites·21 claims
- 0283US10553484B2Semiconductor devices including contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 4, 2020·3 cites·19 claims
- 0379US11114544B2Integrated circuit device having fin-type activeSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·18 claims
- 0475US11955531B2Method of forming an integrated circuit device having a contact capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 0570US12426227B2Method of manufacturing a semiconductor device having a node capping pattern and a gate capping patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0669US11626503B2Integrated circuit device having fin-type activeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0769US11309393B2Integrated circuit device including an overhanging hard mask layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·14 claims
- 0866US11721581B2Semiconductor devices including contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 0963US12015063B2Method of manufacturing an integrated circuit device including a fin-type active regionSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 1062US11778801B2Semiconductor device having a node capping pattern and a gate capping patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1161US10818549B2Semiconductor devices including contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·11 claims
- 1259US2025132257A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US10658288B2Semiconductor device having a metal viaSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1453US2024203831A1Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1552US2024304513A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1652US2024047463A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1751US2024282829A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1849US11189572B2Maintaining height of alignment key in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 1944US2025374638A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →