Inventor · disambiguated record
Michael C. Hamilton
Also filed as: HAMILTON MICHAEL C
10 granted patents·4 pending applications·217 citations·filing 1989–2024
88Inventor score
Top patents by PatentIndex Score
14 records- 0195US5010346AElectro-optical analog-to-digital converter and method for digitizing an analog signalBOEING CO·Filed 1989·Granted Apr 23, 1991·134 cites·24 claims
- 0294US9998122B2Superconducting quantum logic and applications of sameUNIV AUBURN·Filed 2017·Granted Jun 12, 2018·65 cites·43 claims
- 0390US12123845B2Two-dimensional-material-based field-effect transistor for detection of pathogens and methods for manufacturingUNIV AUBURN·Filed 2021·Granted Oct 22, 2024·7 cites·14 claims
- 0479US11069815B2Radiation hardened thin-film transistorsUNIV AUBURN·Filed 2019·Granted Jul 20, 2021·2 cites·12 claims
- 0579US10637479B2Superconducting circuit device and applications of sameUNIV AUBURN·Filed 2018·Granted Apr 28, 2020·3 cites·26 claims
- 0675US12027630B2Radiation hardened thin-film transistorsUNIV AUBURN·Filed 2023·Granted Jul 2, 2024·0 cites·12 claims
- 0773US2025027902A1Two-dimensional-material-based field-effect transistor for detection of pathogens and methods for manufacturingUNIV AUBURN·Filed 2024·Application pending·0 cites
- 0870US10425706B2WDM routerKRUG WILLIAM P·Filed 2011·Granted Sep 24, 2019·2 cites·8 claims
- 0969US11682734B2Radiation hardened thin-film transistorsUNIV AUBURN·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 1062US7894418B2Mixed analog and digital chip-scale reconfigurable WDM networkBOEING CO·Filed 2003·Granted Feb 22, 2011·4 cites·18 claims
- 1153US2024194532A1Multi-layer chip architecture and fabricationGOOGLE LLC·Filed 2022·Application pending·0 cites
- 1253US2024194661A1Multi-layer chip architecture and fabricationGOOGLE LLC·Filed 2022·Application pending·0 cites
- 1351US10879906B2Quantum phase slip junction based adiabatic logic circuits and applications of sameUNIV AUBURN·Filed 2019·Granted Dec 29, 2020·0 cites·29 claims
- 1435US2020227618A1Protective barrier layers for superconducting structuresUNIV AUBURN·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →