Inventor · disambiguated record
Miyuki Harada
Also filed as: HARADA MIYUKI
0 granted patents·4 pending applications·0 citations·filing 2004–2023
Top patents by PatentIndex Score
4 records- 0171US2025215211A1Epoxy resin composition, epoxy resin cured material, and epoxy adhesiveSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0248US2015344749A1Thermally-conductive, electrically-conductive adhesive compositionKANSAI UNIVERSITY·Filed 2013·Application pending·0 cites
- 0346US2007116938A1Polymer composite formed article, printed wiring board using the formed article, and methods of producing themTOBITA MASAYUKI·Filed 2005·Application pending·0 cites
- 0437US2004224163A1Thermally-conductive epoxy resin molded article and method of producing the samePOLYMATECH CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →