Inventor · disambiguated record
Michael E. Hess
Also filed as: HESS MICHAEL E
36 granted patents·809 citations·filing 1996–2006
98Inventor score
Files withMICRON TECHNOLOGY INC35
Top patents by PatentIndex Score
36 records- 0198US6578458B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·106 cites·24 claims
- 0291US6553276B2Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 22, 2003·48 cites·35 claims
- 0390US6427676B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·24 cites·18 claims
- 0490US5907492AMethod for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1997·Granted May 25, 1999·81 cites·26 claims
- 0589US6400174B2Test system having alignment member for aligning semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·31 cites·21 claims
- 0689US6285203B1Test system having alignment member for aligning semiconductor componentsMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 4, 2001·53 cites·34 claims
- 0788US6401580B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 11, 2002·20 cites·9 claims
- 0887US6363295B1Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 26, 2002·64 cites·35 claims
- 0986US6691696B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 17, 2004·17 cites·7 claims
- 1086US6119675AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 19, 2000·38 cites·11 claims
- 1185US6006739AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 28, 1999·52 cites·20 claims
- 1283US7155300B2Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 26, 2006·25 cites·20 claims
- 1381US6250192B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 26, 2001·29 cites·7 claims
- 1481US6155247AMethod for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 5, 2000·27 cites·18 claims
- 1580US7120513B1Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 10, 2006·26 cites·102 claims
- 1680US6417685B1Test system having alignment member for aligning semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 9, 2002·17 cites·15 claims
- 1779US7561938B2Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·7 cites·24 claims
- 1876US6045026AUtilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 4, 2000·23 cites·47 claims
- 1975US6296171B1Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·22 cites·10 claims
- 2073US6687990B2Sawing method employing multiple indexing techniques and semiconductor device structures fabricated therebyMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·13 cites·19 claims
- 2173US6196096B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·18 cites·26 claims
- 2270US6932077B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatusMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 23, 2005·5 cites·23 claims
- 2370US6631662B2Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 14, 2003·5 cites·20 claims
- 2470US6255196B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 3, 2001·5 cites·20 claims
- 2569US6419143B2Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 16, 2002·8 cites·10 claims
- 2667US6459105B2Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 1, 2002·4 cites·21 claims
- 2765US6427899B2Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·6 cites·20 claims
- 2862US6619532B2Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·5 cites·10 claims
- 2960US6897571B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2002·Granted May 24, 2005·2 cites·21 claims
- 3059US6423616B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 23, 2002·2 cites·20 claims
- 3158US6998334B2Semiconductor devices with permanent polymer stencil and method for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 14, 2006·19 cites·73 claims
- 3257US7387119B2Dicing saw with variable indexing capabilityMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 17, 2008·0 cites·20 claims
- 3356US6493934B2Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsFiled 2001·Granted Dec 17, 2002·4 cites·20 claims
- 3454US6279563B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 28, 2001·1 cites·22 claims
- 3552US6851597B2Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 8, 2005·2 cites·20 claims
- 3640US7589010B2Semiconductor devices with permanent polymer stencil and method for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 15, 2009·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →