Inventor · disambiguated record
Michael Hirschberger
Also filed as: HIRSCHBERGER MICHAEL
9 granted patents·1 pending application·181 citations·filing 1985–2009
89Inventor score
Files withHOOVER UNIVERSAL6HOOVER UNIVERSITY INC1OWENS ILLINOIS INC1OWENS ILLINOIS PLASTIC PROD1RUHRPUMPEN GMBH1
Top patents by PatentIndex Score
10 records- 0175US5046938AImproved multiple layer die head with adjustable gapsHOOVER UNIVERSAL·Filed 1990·Granted Sep 10, 1991·40 cites·15 claims
- 0272US4740415ALow density polyethylene and linear low density polyethylene blended composition and articles prepared therefromOWENS ILLINOIS PLASTIC PROD·Filed 1986·Granted Apr 26, 1988·24 cites·6 claims
- 0370US4890994AApparatus for forming a parison with a view stripeHOOVER UNIVERSITY INC·Filed 1988·Granted Jan 2, 1990·34 cites·12 claims
- 0468US5204120AIntermittent multi-layer multi-parison extrusion headHOOVER UNIVERSAL·Filed 1992·Granted Apr 20, 1993·29 cites·17 claims
- 0561US5055022AMultiple parison extrusion device for producing laminar articlesHOOVER UNIVERSAL·Filed 1990·Granted Oct 8, 1991·23 cites·4 claims
- 0647US2010014963A1Centrifugal pumpRUHRPUMPEN GMBH·Filed 2009·Application pending·0 cites
- 0742US5114333ADie head for plastic with barrier forming materialHOOVER UNIVERSAL·Filed 1990·Granted May 19, 1992·11 cites·3 claims
- 0841US5221540AExtrusion head with adjustable view stripe positioningHOOVER UNIVERSAL·Filed 1992·Granted Jun 22, 1993·10 cites·14 claims
- 0936US4940403ADual parison extrusion head for multi-layer blow moldingHOOVER UNIVERSAL·Filed 1989·Granted Jul 10, 1990·7 cites·12 claims
- 1030US4622199AProcess for extruding high molecular weight, high density linear ethylene polymers to form heavy tubular membersOWENS ILLINOIS INC·Filed 1985·Granted Nov 11, 1986·3 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Michael Hirschberger files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →