Inventor · disambiguated record
Misato Hisano
Also filed as: HISANO MISATO
2 granted patents·1 pending application·0 citations·filing 2014–2024
28Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0150US2025054806A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0241US10325776B2Method of manufacturing semiconductor device including forming protective film within recess in substrateMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 18, 2019·0 cites·2 claims
- 0338US9947544B2Method of manufacturing semiconductor device including forming protective film within recess in substrateMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 17, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →