Inventor · disambiguated record
Ming-Che Ho
Also filed as: HO MING-CHE
114 granted patents·26 pending applications·384 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD87TAIWAN SEMICONDUCTOR MFG8ETRON TECHNOLOGY INC4UWIZ TECH CO LTD4WISTRON CORP4
Top patents by PatentIndex Score
140 records- 0198US11823981B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·5 cites·20 claims
- 0295US8981559B2Package on package devices and methods of packaging semiconductor diesHSU CHUN-LEI·Filed 2012·Granted Mar 17, 2015·50 cites·20 claims
- 0395US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 0495US8405199B2Conductive pillar for semiconductor substrate and method of manufactureLU WEN-HSIUNG·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 0593US10297544B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·7 cites·20 claims
- 0692US10049894B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·7 cites·20 claims
- 0792US9257401B2Method of fabricating bump structure and bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 9, 2016·9 cites·20 claims
- 0892US8609526B2Preventing UBM oxidation in bump formation processesLIU CHUNG-SHI·Filed 2010·Granted Dec 17, 2013·16 cites·20 claims
- 0991US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 1091US10163832B1Integrated fan-out package, redistribution circuit structure, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·12 cites·19 claims
- 1191US9601355B2Via structure for packaging and a method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 21, 2017·4 cites·20 claims
- 1291US8172641B2CMP by controlling polish temperatureHO MING-CHE·Filed 2008·Granted May 8, 2012·29 cites·13 claims
- 1390US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 1489US10510646B2Packae structure, RDL structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 1588US11031342B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·5 cites·20 claims
- 1688US10861814B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·5 cites·20 claims
- 1788US9397080B2Package on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·6 cites·20 claims
- 1888US9030010B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 12, 2015·7 cites·20 claims
- 1988US8827695B2Wafer's ambiance controlHSIAO YI-LI·Filed 2009·Granted Sep 9, 2014·14 cites·20 claims
- 2087US10985116B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·20 claims
- 2187US9099396B2Post-passivation interconnect structure and method of forming the sameWU YI-WEN·Filed 2011·Granted Aug 4, 2015·8 cites·20 claims
- 2286US11605601B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 2385US12288729B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
- 2485US9935047B2Bonding structures and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·4 cites·20 claims
- 2585US9472524B2Copper-containing layer on under-bump metallization layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·4 cites·20 claims
- 2685US9430605B2Adjusting sizes of connectors of package componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 2785US2025079341A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2884US8569897B2Protection layer for preventing UBM layer from chemical attack and oxidationLIU CHUNG-SHI·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 2983US11018083B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 3083US10950519B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 3183US2024379519A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3283US2024379536A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3382US12131986B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 3482US11056412B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·2 cites·20 claims
- 3581US12191203B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·7 claims
- 3681US12183691B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 3781US11935804B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 3881US11393763B2Integrated fan-out (info) package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 3981US2025096044A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4081US2025293106A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4181US2025300096A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4280US12322682B2Semiconductor package having composite seed-barrier layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 4380US2025070013A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4480US2025357294A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US8993431B2Method of fabricating bump structureHSU CHUN-LEI·Filed 2010·Granted Mar 31, 2015·5 cites·20 claims
- 4679US8791579B2Adjusting sizes of connectors of package componentsLAI CHIH-WEI·Filed 2011·Granted Jul 29, 2014·6 cites·17 claims
- 4779US2024371778A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4879US2025259913A1Semiconductor package having composite seed-barrier layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4978US12176282B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 5078US9653418B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·20 claims
Showing the top 50 of 140 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →