Inventor · disambiguated record
Michael V. Ho
Also filed as: HO MICHAEL · HO MICHAEL V · HO MICHAEL V D
29 granted patents·5 pending applications·202 citations·filing 1993–2021
95Inventor score
Files withMICRON TECHNOLOGY INC21HO MICHAEL7HO MICHAEL V3WINBOND ELECTRONICS CORP2TEXAS INSTRUMENTS INC1
Top patents by PatentIndex Score
34 records- 0186US10395701B1Memory device with a latching mechanismMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 27, 2019·7 cites·20 claims
- 0281US10950291B1Apparatuses and methods to perform duty cycle adjustment with back-bias voltageMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 16, 2021·2 cites·21 claims
- 0380US10366743B1Memory with a reduced array data bus footprintMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 30, 2019·4 cites·19 claims
- 0480US7583664B2Techniques for transmitting and receiving traffic over advanced switching compatible switch fabricsHO MICHAEL·Filed 2004·Granted Sep 1, 2009·44 cites·41 claims
- 0577US5880004ATrench isolation processWINBOND ELECTRONICS CORP·Filed 1997·Granted Mar 9, 1999·60 cites·6 claims
- 0677US5410510AProcess of making and a DRAM standby charge pump with oscillator having fuse selectable frequenciesTEXAS INSTRUMENTS INC·Filed 1993·Granted Apr 25, 1995·39 cites·22 claims
- 0772USRE45248ECascaded connection matrices in a distributed cross-connection systemHO MICHAEL·Filed 2011·Granted Nov 18, 2014·2 cites·32 claims
- 0870US10157661B1Mitigating line-to-line capacitive coupling in a memory dieMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 0965US11145354B2Apparatuses and methods to perform duty cycle adjustment with back-bias voltageMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 12, 2021·0 cites·19 claims
- 1065USRE47959ECascaded connection matrices in a distributed cross-connection systemMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 21, 2020·1 cites·29 claims
- 1163US10460791B2Systems and methods for generating stagger delays in memory devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 29, 2019·1 cites·12 claims
- 1261US5858857AMethod of forming top corner rounding of shallow trenches in semiconductor substrateWINBOND ELECTRONICS CORP·Filed 1997·Granted Jan 12, 1999·30 cites·7 claims
- 1360US10825506B2Systems and methods for improving output signal quality in memory devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·1 cites·20 claims
- 1460US10438649B2Systems and methods for conserving power in signal quality operations for memory devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·1 cites·20 claims
- 1559US10614870B2Low power method and system for signal slew rate controlMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 7, 2020·1 cites·20 claims
- 1659US7936199B2Apparatus and method for external to internal clock generationMICRON TECHNOLOGY INC·Filed 2008·Granted May 3, 2011·1 cites·10 claims
- 1756US8169759B2Circuit and methods to protect input bufferHO MICHAEL V·Filed 2008·Granted May 1, 2012·1 cites·21 claims
- 1853US7512060B1Method and apparatus for providing a connection matrixHO MICHAEL·Filed 2004·Granted Mar 31, 2009·4 cites·27 claims
- 1951US10747470B2Semiconductor device with pseudo flow through scheme for power savingsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 2051US10580478B2Systems and methods for generating stagger delays in memory devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 2150US10699774B2Mitigating line-to-line capacitive coupling in a memory dieMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 2249US11217298B2Delay-locked loop clock sharingMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 2349US10790012B2Memory with a reduced array data bus footprintMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 29, 2020·0 cites·22 claims
- 2448US8508278B2Apparatus and method for external to internal clock generationHO MICHAEL V·Filed 2011·Granted Aug 13, 2013·0 cites·15 claims
- 2548US7602777B2Cascaded connection matrices in a distributed cross-connection systemHO MICHAEL·Filed 2004·Granted Oct 13, 2009·1 cites·22 claims
- 2647US8705218B2Input buffer protectionHO MICHAEL V·Filed 2012·Granted Apr 22, 2014·0 cites·30 claims
- 2743US2019347219A1Memory devices having a reduced global data path footprint and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 2842US2006140226A1Techniques for processing traffic transmitted over advanced switching compatible switch fabricsHO MICHAEL·Filed 2004·Application pending·0 cites
- 2941US11158570B2Semiconductor devices having electrostatic discharge layouts for reduced capacitanceMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 26, 2021·0 cites·22 claims
- 3041US2006067314A1Overhead processing and generation techniquesHO MICHAEL·Filed 2004·Application pending·0 cites
- 3139US10747693B2Semiconductor device with a time multiplexing mechanism for size efficiencyMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 3239US2019363060A1Apparatuses and methods for pin capacitance reduction including bond pads and circuits in a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 3338US10403353B1Systems and methods for reducing coupling noise between propagation lines for die size efficiencyMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 3436US2006143544A1Remote status forwarding in a distributed cross-connection systemHO MICHAEL·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →