Inventor · disambiguated record
Misato Honda
Also filed as: HONDA MISATO
2 granted patents·1 pending application·10 citations·filing 2013–2018
51Inventor score
Top patents by PatentIndex Score
3 records- 0190US9955583B2Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2014·Granted Apr 24, 2018·10 cites·11 claims
- 0259US2018279482A1Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 0345US9211241B2Oral compositionKAO CORP·Filed 2013·Granted Dec 15, 2015·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →