Inventor · disambiguated record
Michio Horiuchi
Also filed as: HORIUCHI MICHIO
93 granted patents·38 pending applications·1,697 citations·filing 1988–2024
99Inventor score
Files withSHINKO ELECTRIC IND CO107HORIUCHI MICHIO17KATAGIRI FUMIMASA1KOBAYASHI TSUYOSHI1SATO KAZUNORI1
Top patents by PatentIndex Score
131 records- 0196US7659021B2Power generating apparatus using solid oxide fuel cellSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 9, 2010·33 cites·18 claims
- 0296US7169501B2Fuel cellSHINKO ELECTRIC IND CO·Filed 2003·Granted Jan 30, 2007·105 cites·2 claims
- 0395US6774467B2Semiconductor device and process of production of sameSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 10, 2004·178 cites·4 claims
- 0493US11733162B2Ultraviolet detection material and ultraviolet detection deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 22, 2023·2 cites·6 claims
- 0591US8138609B2Semiconductor device and method of manufacturing semiconductor deviceHORIUCHI MICHIO·Filed 2010·Granted Mar 20, 2012·16 cites·10 claims
- 0691US6469260B2Wiring boards, semiconductor devices and their production processesSHINKO ELECTRIC IND CO·Filed 2001·Granted Oct 22, 2002·67 cites·30 claims
- 0791US5737191AStructure and process for mounting semiconductor chipSHINKO ELECTRIC IND CO·Filed 1996·Granted Apr 7, 1998·137 cites·29 claims
- 0889US6465886B1Semiconductor device having circuit pattern and lands thereonSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 15, 2002·56 cites·3 claims
- 0988US8134444B2Inductor and manufacturing method thereofHORIUCHI MICHIO·Filed 2010·Granted Mar 13, 2012·8 cites·10 claims
- 1085US9460983B2Joining structure using thermal interface materialHORIUCHI MICHIO·Filed 2012·Granted Oct 4, 2016·8 cites·1 claims
- 1185US6297553B1Semiconductor device and process for producing the sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Oct 2, 2001·63 cites·2 claims
- 1285US4827082ACeramic packageSHINKO ELECTRIC IND CO·Filed 1988·Granted May 2, 1989·73 cites·9 claims
- 1384US11721574B2Member for electrostatic chuck and electrostatic chuckSHINKO ELECTRIC IND CO·Filed 2021·Granted Aug 8, 2023·1 cites·11 claims
- 1484US6849945B2Multi-layered semiconductor device and method for producing the sameSHINKO ELECTRIC IND CO·Filed 2001·Granted Feb 1, 2005·38 cites·8 claims
- 1582US6522017B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2001·Granted Feb 18, 2003·27 cites·11 claims
- 1682US6093476AWiring substrate having viasSHINKO ELECTRIC IND CO·Filed 1998·Granted Jul 25, 2000·69 cites·10 claims
- 1782US5602059ASemiconductor device and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1995·Granted Feb 11, 1997·72 cites·8 claims
- 1881US6731010B2Resin sealed stacked semiconductor packages with flat surfacesSHINKO ELECTRIC IND CO·Filed 2001·Granted May 4, 2004·31 cites·7 claims
- 1980US8304664B2Electronic component mounted structureKOBAYASHI TSUYOSHI·Filed 2010·Granted Nov 6, 2012·5 cites·8 claims
- 2078US7566513B2Solid electrolyte fuel cell with a multi-layer cathode formed of a solid electrolyte and electrode admixtureSHINKO ELECTRIC IND CO·Filed 2006·Granted Jul 28, 2009·5 cites·3 claims
- 2177US8324513B2Wiring substrate and semiconductor apparatus including the wiring substrateHORIUCHI MICHIO·Filed 2011·Granted Dec 4, 2012·5 cites·8 claims
- 2277US7655346B2Electrode material and fuel cellSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·3 cites·8 claims
- 2377US7656013B2Multilayer wiring substrate, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 2, 2010·8 cites·7 claims
- 2476US6194668B1Multi-layer circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Feb 27, 2001·49 cites·3 claims
- 2576US6084295ASemiconductor device and circuit board used thereinSHINKO ELECTRIC IND CO·Filed 1998·Granted Jul 4, 2000·66 cites·13 claims
- 2674US5294576AMullite ceramic compoundSHINKO ELECTRIC IND CO·Filed 1992·Granted Mar 15, 1994·26 cites·10 claims
- 2773US6407344B1Multilayer circuit boardSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 18, 2002·20 cites·19 claims
- 2873US6256207B1Chip-sized semiconductor device and process for making sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 3, 2001·43 cites·16 claims
- 2973US5943212ACeramic circuit board and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1997·Granted Aug 24, 1999·46 cites·11 claims
- 3072US6660942B2Semiconductor device with an exposed external-connection terminalSHINKO ELECTRIC IND CO·Filed 2001·Granted Dec 9, 2003·15 cites·18 claims
- 3171US9960120B2Wiring substrate with buried substrate having linear conductorsSHINKO ELECTRIC IND CO·Filed 2016·Granted May 1, 2018·2 cites·10 claims
- 3271US6229099B1Multi-layer circuit board with particular pad spacingSHINKO ELECTRIC IND CO·Filed 1998·Granted May 8, 2001·37 cites·6 claims
- 3371US4935390AMullite-based ceramic bodySHINKO ELECTRIC IND CO·Filed 1988·Granted Jun 19, 1990·25 cites·8 claims
- 3470US8242612B2Wiring board having piercing linear conductors and semiconductor device using the sameHORIUCHI MICHIO·Filed 2010·Granted Aug 14, 2012·3 cites·10 claims
- 3569US5464950AAluminum nitride circuit board and method of producing sameSHINKO ELECTRIC IND CO·Filed 1993·Granted Nov 7, 1995·30 cites·2 claims
- 3669US2025044043A1Latent heat storage unitSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 3769US2025044042A1Latent heat storage unitSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 3867US12077701B2Ultraviolet detection device comprising a ceramic substrate and composite oxidesSHINKO ELECTRIC IND CO·Filed 2021·Granted Sep 3, 2024·0 cites·9 claims
- 3967US10998216B2Sintered body and electrostatic chuckSHINKO ELECTRIC IND CO·Filed 2017·Granted May 4, 2021·1 cites·14 claims
- 4067US9006586B2Wiring substrate, its manufacturing method, and semiconductor deviceHORIUCHI MICHIO·Filed 2012·Granted Apr 14, 2015·2 cites·10 claims
- 4167US7771886B2Fuel cellSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 10, 2010·1 cites·19 claims
- 4267US6271478B1Multi-layer circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Aug 7, 2001·35 cites·2 claims
- 4367US5604018ACeramic oxide circuit boardSHINKO ELECTRIC IND CO·Filed 1994·Granted Feb 18, 1997·32 cites·14 claims
- 4466US12424476B2Electrostatic chuck, substrate fixing device and pasteSHINKO ELECTRIC IND CO·Filed 2023·Granted Sep 23, 2025·0 cites·11 claims
- 4566US8664764B2Semiconductor device including a core substrate and a semiconductor elementHORIUCHI MICHIO·Filed 2012·Granted Mar 4, 2014·2 cites·17 claims
- 4666US5997999ASintered body for manufacturing ceramic substrateSHINKO ELECTRIC IND CO·Filed 1997·Granted Dec 7, 1999·32 cites·10 claims
- 4766US5229213AAluminum nitride circuit boardSHINKO ELECTRIC IND CO·Filed 1989·Granted Jul 20, 1993·30 cites·1 claims
- 4864US7786597B2Multilayer wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·2 cites·13 claims
- 4964US6452115B2Circuit pattern for multi-layer circuit board for mounting electronic partsSHINKO ELECTRIC IND CO·Filed 2001·Granted Sep 17, 2002·11 cites·6 claims
- 5063US6236112B1Semiconductor device, connecting substrate therefor, and process of manufacturing connecting substrateSHINKO ELECTRIC IND CO·Filed 1999·Granted May 22, 2001·29 cites·13 claims
Showing the top 50 of 131 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →