Inventor · disambiguated record
Ming-Che Hsieh
Also filed as: HSIEH MING · HSIEH MING-CHE
50 granted patents·16 pending applications·187 citations·filing 2006–2024
97Inventor score
Files withBOE TECHNOLOGY GROUP CO LTD23HSIEH MING-CHE11QUANTUMZ INC6AU OPTRONICS CORP4ACADEMIA SINICA2
Top patents by PatentIndex Score
66 records- 0197US9349700B2Semiconductor device and method of forming stress-reduced conductive joint structuresSTATS CHIPPAC LTD·Filed 2014·Granted May 24, 2016·63 cites·14 claims
- 0296US8570272B2Electrophoresis display panelHSIEH MING-CHE·Filed 2010·Granted Oct 29, 2013·35 cites·8 claims
- 0395US11721285B2Display screen, display device, display circuit and brightness compensation method thereforBOE TECHNOLOGY GROUP CO LTD·Filed 2021·Granted Aug 8, 2023·3 cites·20 claims
- 0490US11393887B2Substrate and display apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2019·Granted Jul 19, 2022·3 cites·16 claims
- 0590US9673093B2Semiconductor device and method of making wafer level chip scale packageSTATS CHIPPAC LTD·Filed 2014·Granted Jun 6, 2017·9 cites·26 claims
- 0687US8149498B2Package structure of a flexible display deviceHSIEH MING-CHE·Filed 2010·Granted Apr 3, 2012·10 cites·22 claims
- 0785US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
- 0885US8102058B2Chip package structure and method for fabricating the sameHSIEH MING-CHE·Filed 2010·Granted Jan 24, 2012·8 cites·21 claims
- 0982US9245834B2Semiconductor device and method of forming compliant conductive interconnect structure in flipchip packageHSIEH MING-CHE·Filed 2012·Granted Jan 26, 2016·6 cites·21 claims
- 1080US8193625B2Stacked-chip packaging structure and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Jun 5, 2012·9 cites·9 claims
- 1178US9634270B2Method for manufacturing flexible display panel and flexible display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Apr 25, 2017·3 cites·17 claims
- 1278US7843517B2Touch panel having sensing spacersAU OPTRONICS CORP·Filed 2008·Granted Nov 30, 2010·5 cites·15 claims
- 1376US11676938B2Semiconductor device and method of making wafer level chip scale packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jun 13, 2023·2 cites·12 claims
- 1475US11805679B2Substrate with holes and display apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·19 claims
- 1575US11114631B2Flexible display substrate, manufacturing method thereof, and flexible display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2019·Granted Sep 7, 2021·1 cites·13 claims
- 1675US9553135B2Flexible display substrate and method for manufacturing the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Jan 24, 2017·2 cites·11 claims
- 1775US8503065B2Electrophoretic display structureHSIEH MING-CHE·Filed 2011·Granted Aug 6, 2013·2 cites·18 claims
- 1875US8089603B2Fabrication method of liquid crystal display panelCHU CHIH-WEI·Filed 2011·Granted Jan 3, 2012·2 cites·13 claims
- 1973US9640596B2Flexible display panel, manufacturing method thereof and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted May 2, 2017·1 cites·15 claims
- 2072US9577202B2Flexible display substrate mother board and method of manufacturing flexible display substrateBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Feb 21, 2017·2 cites·20 claims
- 2171US2025108106A1Nanoencapsulated pharmaceutical composition and use thereofFULGENT GENETICS INC·Filed 2024·Application pending·0 cites
- 2270US9859525B2Flexible display substrate and method for manufacturing the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Jan 2, 2018·1 cites·9 claims
- 2370US8437073B2Electrophoretic display deviceHSIEH MING-CHE·Filed 2010·Granted May 7, 2013·1 cites·11 claims
- 2469US8279515B2Electrophoretic displayHSIEH MING-CHE·Filed 2011·Granted Oct 2, 2012·1 cites·26 claims
- 2568US8004079B2Chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2009·Granted Aug 23, 2011·4 cites·34 claims
- 2667US8502224B2Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensorTAIN RA-MIN·Filed 2010·Granted Aug 6, 2013·2 cites·19 claims
- 2765US2025160058A1Semiconductor light-emitting elementQUANTUMZ INC·Filed 2024·Application pending·0 cites
- 2864US2022359042A1Data sifting method and apparatusDELTA ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 2963US12422311B2Multi-zone temperature control device and multi-zone temperature control methodDELTA ELECTRONICS INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 3063US8397584B2Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatusHSIEH MING-CHE·Filed 2011·Granted Mar 19, 2013·1 cites·12 claims
- 3162US2025125881A1Optical transmission moduleQUANTUMZ INC·Filed 2024·Application pending·0 cites
- 3261US11138911B2Display substrate and manufacturing method therefor, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·17 claims
- 3360US11024230B2Display screen, display device, display circuit and brightness compensation method thereforBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Jun 1, 2021·0 cites·19 claims
- 3460US8629966B2Display panel and sealing structureCHU CHIH-WEI·Filed 2009·Granted Jan 14, 2014·1 cites·22 claims
- 3559US2025160045A1Optical detectorQUANTUMZ INC·Filed 2024·Application pending·0 cites
- 3659US2025038101A1Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna InterposerSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 3758US11233111B2Array substrate, manufacturing method of array substrate and display panelBOE TECHNOLOGY GROUP CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·19 claims
- 3855US11502757B1Method of manufacturing device with optical component disposed thereon and transmission device manufactured by the sameQUANTUMZ INC·Filed 2021·Granted Nov 15, 2022·0 cites·14 claims
- 3955US9570692B2Motherboard of flexible display panel and method for manufacturing flexible display panelBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Feb 14, 2017·0 cites·20 claims
- 4055US7973904B2Liquid crystal display panelAU OPTRONICS CORP·Filed 2009·Granted Jul 5, 2011·0 cites·10 claims
- 4153US8673658B2Fabricating method of semiconductor deviceIND TECH RES INST·Filed 2013·Granted Mar 18, 2014·0 cites·11 claims
- 4251US11956534B2Image conversion device for digital image signalsQUANTUMZ INC·Filed 2021·Granted Apr 9, 2024·0 cites·17 claims
- 4350US2023125882A1Signal transmission structureQUANTUMZ INC·Filed 2021·Application pending·0 cites
- 4449US10593898B2Base carrier, flexible display panel and manufacturing method thereof, flexible display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Mar 17, 2020·0 cites·20 claims
- 4548US2008135145A1Vehicle sun shield assemblyHSIEH MING-CHE·Filed 2006·Application pending·0 cites
- 4647US11361730B2Display device, method of automatically adjusting brightness of display screen, and terminal equipmentBOE TECHNOLOGY GROUP CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·19 claims
- 4747US8035791B2Display panel and electro-optical apparatusAU OPTRONICS CORP·Filed 2008·Granted Oct 11, 2011·0 cites·8 claims
- 4847US2009279040A1Liquid Crystal Panel Structure and Method for Manufacturing the SameAU OPTRONICS CORP·Filed 2008·Application pending·0 cites
- 4946US11981846B2Nanocomposite and uses thereofACADEMIA SINICA·Filed 2020·Granted May 14, 2024·0 cites·10 claims
- 5046US11717801B2Micro-reactor and method of useACADEMIA SINICA·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →