Inventor · disambiguated record
Ming Hu
Also filed as: HU MING · HU MING-SHIEN
10 granted patents·3 pending applications·19 citations·filing 2015–2022
81Inventor score
Top patents by PatentIndex Score
13 records- 0195US9443868B1Semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Granted Sep 13, 2016·15 cites·18 claims
- 0276US11910599B2Contact structures for three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·14 claims
- 0373US9768191B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Sep 19, 2017·2 cites·21 claims
- 0472US9553050B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Jan 24, 2017·2 cites·18 claims
- 0568US11552091B2Contact structures for three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·18 claims
- 0657US11923422B2Semiconductor deviceGLOBALWAFERS CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·6 claims
- 0755US2020194447A1Contact structures for three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 0853US11081408B2Methods for wafer warpage controlYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·20 claims
- 0951US2016359005A1Semiconductor deviceGLOBALWAFERS CO LTD·Filed 2016·Application pending·0 cites
- 1042US10461090B2Semiconductor memory device and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 29, 2019·0 cites·12 claims
- 1139US9812398B2Semiconductor memory device having memory cells provided in a height directionTOSHIBA MEMORY CORP·Filed 2015·Granted Nov 7, 2017·0 cites·20 claims
- 1237US9666597B2Semiconductor memory deviceTOSHIBA KK·Filed 2016·Granted May 30, 2017·0 cites·16 claims
- 1333US2016293707A1Semiconductor deviceGLOBALWAFERS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →