Inventor · disambiguated record
Michael J. Hundt
Also filed as: COGNETTI CARLO · HUNDT MICHAEL J · HUNDT MICHAEL JOSEPH
44 granted patents·4 pending applications·1,640 citations·filing 1990–2014
99Inventor score
Files withST MICROELECTRONICS INC21SGS THOMSON MICROELECTRONICS18SGS THOMSON MICROELECTRONICS INC6HUNDT MICHAEL J2ST MICROELECTRONICS SRL1
Top patents by PatentIndex Score
48 records- 0197US5642261ABall-grid-array integrated circuit package with solder-connected thermal conductorSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jun 24, 1997·283 cites·22 claims
- 0295US6028773APackaging for silicon sensorsST MICROELECTRONICS INC·Filed 1997·Granted Feb 22, 2000·178 cites·49 claims
- 0395USD359028SSocketed integrated circuit packageSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted Jun 6, 1995·57 cites·1 claims
- 0492USD358806SSocketed integrated circuit packageSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·41 cites·1 claims
- 0591US5991156ABall grid array integrated circuit package with high thermal conductivityST MICROELECTRONICS INC·Filed 1994·Granted Nov 23, 1999·112 cites·10 claims
- 0690US7244967B2Apparatus and method for attaching an integrating circuit sensor to a substrateST MICROELECTRONICS INC·Filed 2004·Granted Jul 17, 2007·52 cites·20 claims
- 0787US5805419ALow-profile socketed packaging system with land-grid array and thermally conductive slugST MICROELECTRONICS INC·Filed 1996·Granted Sep 8, 1998·70 cites·31 claims
- 0887US5283717ACircuit assembly having interposer lead frameSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Feb 1, 1994·96 cites·12 claims
- 0984US5557504ASurface mountable integrated circuit package with detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Sep 17, 1996·76 cites·20 claims
- 1082US5196374AIntegrated circuit package with molded cellSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Mar 23, 1993·72 cites·3 claims
- 1180US5590462AProcess for dissipating heat from a semiconductor packageST MICROELECTRONICS SRL·Filed 1995·Granted Jan 7, 1997·54 cites·5 claims
- 1278US7315079B2Thermally-enhanced ball grid array package structure and methodST MICROELECTRONICS INC·Filed 2007·Granted Jan 1, 2008·7 cites·15 claims
- 1375US5693572ABall grid array integrated circuit package with high thermal conductivitySGS THOMSON MICROELECTRONICS·Filed 1996·Granted Dec 2, 1997·44 cites·11 claims
- 1474US6686227B2Method and system for exposed die molding for integrated circuit packagingST MICROELECTRONICS INC·Filed 2002·Granted Feb 3, 2004·20 cites·20 claims
- 1573US5124782AIntegrated circuit package with molded cellSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Jun 23, 1992·50 cites·8 claims
- 1672US5570273ASurface mountable integrated circuit package with low-profile detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 29, 1996·47 cites·16 claims
- 1771US7304362B2Molded integrated circuit package with exposed active areaST MICROELECTRONICS INC·Filed 2002·Granted Dec 4, 2007·15 cites·20 claims
- 1869US5403782ASurface mountable integrated circuit package with integrated battery mountSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Apr 4, 1995·40 cites·12 claims
- 1968US7402454B2Molded integrated circuit package with exposed active areaST MICROELECTRONICS INC·Filed 2006·Granted Jul 22, 2008·3 cites·19 claims
- 2067US5994774ASurface mountable integrated circuit package with detachable module and interposerST MICROELECTRONICS INC·Filed 1997·Granted Nov 30, 1999·33 cites·20 claims
- 2166US5461257AIntegrated circuit package with flat-topped heat sinkSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 24, 1995·29 cites·7 claims
- 2264US6372543B1Wrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 2000·Granted Apr 16, 2002·10 cites·20 claims
- 2364US5294829AIC package having direct attach backup batterySGS THOMSON MICROELECTRONICS·Filed 1992·Granted Mar 15, 1994·34 cites·11 claims
- 2463US8163220B2Method of packaging integrated circuitsHUNDT MICHAEL J·Filed 2008·Granted Apr 24, 2012·2 cites·20 claims
- 2563US6817854B2Mold with compensating baseST MICROELECTRONICS INC·Filed 2002·Granted Nov 16, 2004·8 cites·20 claims
- 2662US9012264B2Integrated circuit package including embedded thin-film batteryST MICROELECTRONICS INC·Filed 2014·Granted Apr 21, 2015·1 cites·20 claims
- 2762US6815262B2Apparatus and method for attaching an integrated circuit sensor to a substrateST MICROELECTRONICS INC·Filed 2002·Granted Nov 9, 2004·9 cites·20 claims
- 2862US2009278503A1Thin-film battery equipmentST MICROELECTRONICS INC·Filed 2009·Application pending·0 cites
- 2960US6113399ALow-profile socketed packaging system with land-grid array and thermally conductive slugST MICROELECTRONICS INC·Filed 1998·Granted Sep 5, 2000·19 cites·22 claims
- 3060US5451715AMolded package integrated circuit with electrochemical cellSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Sep 19, 1995·27 cites·18 claims
- 3160US5289034AIC package having replaceable backup batterySGS THOMSON MICROELECTRONICS·Filed 1993·Granted Feb 22, 1994·28 cites·18 claims
- 3258US5677247ALow-profile socketed packaging system with land-grid array and thermally conductive slugSGS THOMSON MICROELECTRONICS·Filed 1996·Granted Oct 14, 1997·18 cites·1 claims
- 3354US5498903ASurface mountable integrated circuit package with integrated battery mountSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Mar 12, 1996·21 cites·11 claims
- 3452US6121678AWrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 1997·Granted Sep 19, 2000·15 cites·19 claims
- 3552US5610800ASubstrate mounting of circuit components with a low profileSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Mar 11, 1997·18 cites·18 claims
- 3652USD358805SDetachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·7 cites·1 claims
- 3750US5489752AProcess for dissipating heat from a semiconductor packageSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Feb 6, 1996·16 cites·9 claims
- 3848US6586821B1Lead-frame forming for improved thermal performanceST MICROELECTRONICS INC·Filed 2000·Granted Jul 1, 2003·3 cites·6 claims
- 3947US8766435B2Integrated circuit package including embedded thin-film batteryHUNDT MICHAEL J·Filed 2004·Granted Jul 1, 2014·4 cites·24 claims
- 4047US7180175B2Thermally-enhanced ball grid array package structure and methodST MICROELECTRONICS INC·Filed 2002·Granted Feb 20, 2007·2 cites·17 claims
- 4146USD358804SDetachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·5 cites·1 claims
- 4246US2010019374A1Ball grid array packageST MICROELECTRONICS INC·Filed 2008·Application pending·0 cites
- 4345US2004081860A1Thin-film battery equipmentST MICROELECTRONICS INC·Filed 2002·Application pending·0 cites
- 4442US2005082718A1Mold with compensating baseST MICROELECTRONICS INC·Filed 2004·Application pending·0 cites
- 4541US5711069AMethod of making an integrated circuit package with flat-topped heat sinkSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Jan 27, 1998·8 cites·12 claims
- 4638USD354275SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·3 cites·1 claims
- 4732USD354274SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·1 cites·1 claims
- 4830US5491889AApparatus for achieving printed circuit board planaritySGS THOMSON MICROELECTRONICS·Filed 1993·Granted Feb 20, 1996·2 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →