Inventor · disambiguated record
Minyoung Hur
Also filed as: HUR MINYOUNG
7 granted patents·15 pending applications·6 citations·filing 2019–2025
74Inventor score
Files withSAMSUNG ELECTRONICS CO LTD22
Top patents by PatentIndex Score
22 records- 0193US11545341B2Plasma etching method and semiconductor device fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 3, 2023·4 cites·20 claims
- 0279US11282679B2Plasma control apparatus and plasma processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0369US12020903B2Plasma etching method and semiconductor device fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·10 claims
- 0469US2025266247A1Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0568US12322577B2Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 0666US2025146917A1Method of measuring parameters of plasma, apparatus for measuring parameters of plasma, plasma processing system, and method of processing waferSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0763US2025349516A1Plasma control apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0862US12222362B2Method of measuring parameters of plasma, apparatus for measuring parameters of plasma, plasma processing system, and method of processing waferSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·17 claims
- 0961US2025266242A1Plasma etching devices and methods for fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1059US2025183005A1Substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025174433A1Method of processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1257US12210045B2Impedance measurement jig and method of controlling a substrate-processing apparatus using the jigSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·16 claims
- 1357US2025259827A1Plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1457US2025379038A1Plasma etching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1556US2025316458A1Apparatus for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US2025246467A1Manufacturing apparatus of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1755US2025189347A1Sensor device for semiconductor equipment, method of operating a sensor device, and system including a sensor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1855US2025273442A1Plasma processing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1954US11398397B2Electrostatic chuck and plasma processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 2051US2024234094A9Plasma control device and plasma control methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2150US2024128056A1Plasma etching apparatus and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2250US2023187185A1Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →