Inventor · disambiguated record
Ming-Hang Hwang
Also filed as: HWANG MING-HANG
2 granted patents·9 pending applications·1 citations·filing 2006–2006
31Inventor score
Top patents by PatentIndex Score
11 records- 0154US7504148B2Printed circuit board structure and manufacturing method thereofMITAC TECHNOLOGY CORP·Filed 2006·Granted Mar 17, 2009·1 cites·3 claims
- 0245US2007199682A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0343US2007199681A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0435US7427807B2Chip heat dissipation structure and manufacturing methodMITAC TECHNOLOGY CORP·Filed 2006·Granted Sep 23, 2008·0 cites·18 claims
- 0533US2007201203A1Adhesion Material Structure and Process Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0633US2007199678A1Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0733US2006255451A1Heat Conduction Interface Method and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0830US2007199677A1Heat Sink Fin Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0930US2007199679A1Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1030US2007201207A1Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1128US2006256528A1Air Blown Chip Dissipation Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →