Inventor · disambiguated record

Min Seok Jin

Also filed as: JIN MIN SEOK

1 granted patent·3 citations·filing 2015–2015

22Inventor score

Technology areasH10W

Files withHAESUNG DS CO LTD1

Top patents by PatentIndex Score

1 record

0172US9460986B2Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2015·Granted Oct 4, 2016·3 cites·9 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →