Inventor · disambiguated record
Min-Kyu Kang
Also filed as: KANG MIN · KANG MIN-KYU
18 granted patents·6 pending applications·22 citations·filing 2003–2025
89Inventor score
Files withLG ENERGY SOLUTION LTD6SK HYNIX INC6CJ CHEILJEDANG CORP3SAMSUNG ELECTRONICS CO LTD3IUCF HYU ERICA CAMPUS2
Top patents by PatentIndex Score
24 records- 0197US12134107B2Multi-slot die coaterLG ENERGY SOLUTION LTD·Filed 2021·Granted Nov 5, 2024·7 cites·20 claims
- 0296US12420303B2Dual slot die coater and method for coating electrode active material slurry using the sameLG ENERGY SOLUTION LTD·Filed 2021·Granted Sep 23, 2025·2 cites·16 claims
- 0391US10804209B2Semiconductor packages including a supporting block supporting an upper chip stackSK HYNIX INC·Filed 2018·Granted Oct 13, 2020·9 cites·20 claims
- 0490US2025375790A1Dual Slot Die Coater and Method for Coating Electrode Active Material Slurry Using the SameLG ENERGY SOLUTION LTD·Filed 2025·Application pending·0 cites
- 0566US12508621B2Dual slot die coaterLG ENERGY SOLUTION LTD·Filed 2021·Granted Dec 30, 2025·0 cites·14 claims
- 0666US10600713B2Semiconductor packages including a heat insulation wallSK HYNIX INC·Filed 2018·Granted Mar 24, 2020·1 cites·21 claims
- 0762US10981937B2Methionine-metal chelate and manufacturing method thereofCJ CHEILJEDANG CORP·Filed 2018·Granted Apr 20, 2021·0 cites·11 claims
- 0861US12502244B2Method for manufacturing adhesion-preventing filmMEPION CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·16 claims
- 0960US2023080280A1Multi-Slot Die CoaterLG ENERGY SOLUTION LTD·Filed 2021·Application pending·0 cites
- 1059US11798715B2Mn—Bi—Sb-based magnetic substance and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2020·Granted Oct 24, 2023·0 cites·8 claims
- 1159US11270923B2Semiconductor packages including a heat insulation wallSK HYNIX INC·Filed 2020·Granted Mar 8, 2022·0 cites·11 claims
- 1259US11072621B2Methionine-metal chelate and manufacturing method thereofCJ CHEILJEDANG CORP·Filed 2018·Granted Jul 27, 2021·0 cites·9 claims
- 1358US11840496B2Method of preparing L-homoserineCJ CHEILJEDANG CORP·Filed 2020·Granted Dec 12, 2023·0 cites·15 claims
- 1456US12397316B2Multi-slot die coaterLG ENERGY SOLUTION LTD·Filed 2021·Granted Aug 26, 2025·0 cites·10 claims
- 1552US2009321864A1Cmos image sensor and method for manufacturing the sensorKANG MIN-KYU·Filed 2009·Application pending·0 cites
- 1651US10998294B2Semiconductor packages having stacked chip structureSK HYNIX INC·Filed 2019·Granted May 4, 2021·0 cites·25 claims
- 1750US9227258B2Lead-free solder alloy having reduced shrinkage cavitiesKAWAMATA YUJI·Filed 2009·Granted Jan 5, 2016·1 cites·14 claims
- 1850US2021327619A1Magnetic nanostructures comprising copper and preparation method of sameIUCF HYU ERICA CAMPUS·Filed 2019·Application pending·0 cites
- 1949US10393646B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2018·Granted Aug 27, 2019·0 cites·9 claims
- 2046US9945772B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2016·Granted Apr 17, 2018·0 cites·18 claims
- 2146US6855993B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 15, 2005·2 cites·6 claims
- 2245US7259070B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 21, 2007·0 cites·17 claims
- 2342US2021327618A1Magnetic nano-structure containing iron and method for manufacturing sameIUCF HYU ERICA CAMPUS·Filed 2019·Application pending·0 cites
- 2440US2020051790A1Pressure control ring, plasma processing apparatus including the same and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →