Inventor · disambiguated record
Ming-Hong Kao
Also filed as: KAO MING-HONG
5 granted patents·1 pending application·2 citations·filing 2018–2024
68Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
Top patents by PatentIndex Score
6 records- 0184US11688759B2Metal-insulator-metal capacitive structure and methods of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0280US2024371746A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0379US12125782B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0474US10867903B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 0570US11587863B2Semiconductor structure and method of forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 0657US11056556B2Metal-insulator-metal capacitive structure and methods of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →