Inventor · disambiguated record
Mineo Kawamoto
Also filed as: KAWAMOTO MINEO · MATSUDA YOICHI · MORISHITA HIROSADA
23 granted patents·511 citations·filing 1976–2010
97Inventor score
Top patents by PatentIndex Score
23 records- 0187US4099974AElectroless copper solutionHITACHI LTD·Filed 1976·Granted Jul 11, 1978·35 cites·8 claims
- 0285US7894200B2Printed wiring board with built-in semiconductor element, and process for producing the sameNIPPON CMK KK·Filed 2006·Granted Feb 22, 2011·11 cites·7 claims
- 0385US4604160AMethod for manufacture of printed wiring boardHITACHI LTD·Filed 1985·Granted Aug 5, 1986·87 cites·18 claims
- 0481US4820549APhoto-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin compositionHITACHI LTD·Filed 1987·Granted Apr 11, 1989·29 cites·3 claims
- 0580US5028513AProcess for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Jul 2, 1991·40 cites·21 claims
- 0680US4151313AMethod for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking materialHITACHI LTD·Filed 1978·Granted Apr 24, 1979·26 cites·7 claims
- 0777US8035979B2Printed wiring board with built-in semiconductor element, and process for producing the sameNIPPON CMK KK·Filed 2010·Granted Oct 11, 2011·4 cites·7 claims
- 0872US6190834B1Photosensitive resin composition, and multilayer printed circuit board using the sameHITACHI LTD·Filed 1998·Granted Feb 20, 2001·44 cites·19 claims
- 0968US4457952AProcess for producing printed circuit boardsHITACHI LTD·Filed 1983·Granted Jul 3, 1984·24 cites·10 claims
- 1065US5849460APhotosensitive resin composition and method for using the same in manufacture of circuit boardsHITACHI LTD·Filed 1997·Granted Dec 15, 1998·26 cites·6 claims
- 1165US4293592AMethod for production of printed circuits by electroless metal platingHITACHI LTD·Filed 1976·Granted Oct 6, 1981·25 cites·11 claims
- 1265US4239813AProcess for forming printed wiring by electroless depositionHITACHI LTD·Filed 1979·Granted Dec 16, 1980·16 cites·8 claims
- 1364US4865888AProcess for electroless copper plating and apparatus used thereforHITACHI LTD·Filed 1988·Granted Sep 12, 1989·23 cites·21 claims
- 1460US5914216AMultilayer circuit board and photosensitive resin composition used thereforHITACHI LTD·Filed 1997·Granted Jun 22, 1999·18 cites·16 claims
- 1559US4632852AProcess for electroless copper platingHITACHI LTD·Filed 1985·Granted Dec 30, 1986·20 cites·31 claims
- 1657US4378384AProcess for producing printed circuit board by electroless platingHITACHI LTD·Filed 1981·Granted Mar 29, 1983·16 cites·20 claims
- 1756US4876177AProcess for producing printed circuit boardHITACHI LTD·Filed 1987·Granted Oct 24, 1989·17 cites·34 claims
- 1853US4610910APrinted circuit board, process for preparing the same and resist ink used thereforHITACHI LTD·Filed 1984·Granted Sep 9, 1986·11 cites·14 claims
- 1951US5356698AAdhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing sameHITACHI LTD·Filed 1993·Granted Oct 18, 1994·16 cites·32 claims
- 2042US5712080AMethod for manufacturing printed circuit boardHITACHI LTD·Filed 1997·Granted Jan 27, 1998·9 cites·7 claims
- 2140US5476690AProcess for preparing printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Dec 19, 1995·8 cites·13 claims
- 2234US5139923AMethod for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereonHITACHI LTD·Filed 1991·Granted Aug 18, 1992·5 cites·13 claims
- 2330US6306481B1Multilayer circuit board having insulating layer with via-holesHITACHI LTD·Filed 1999·Granted Oct 23, 2001·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →