Inventor · disambiguated record
Michiko Kaya
Also filed as: KAYA MICHIKO
1 granted patent·3 pending applications·2 citations·filing 2006–2023
19Inventor score
Top patents by PatentIndex Score
4 records- 0165US7772317B2Resin molding materialHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 10, 2010·2 cites·18 claims
- 0264US2025293192A1Film-form adhesive, adhesive film, integrated dicing/die bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0362US2025289980A1Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and production method for semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0435US2023005782A1Film-like adhesive and method for evaluating ease of splitting, dicing/die-bonding integrated film and method for manufacturing, and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →