Inventor · disambiguated record
Minjung Kim
Also filed as: KIM MINJUNG
102 granted patents·53 pending applications·264 citations·filing 2001–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD77LG ELECTRONICS INC16KIM MINJUNG9KOLON LIFE SCIENCE INC7LG CHEMICAL LTD7
Top patents by PatentIndex Score
155 records- 0196US9413043B2Cooling member of improved assembly efficiency and battery module employed with the sameLG CHEMICAL LTD·Filed 2013·Granted Aug 9, 2016·17 cites·13 claims
- 0296US8802259B2Battery pack of compact structureLG CHEMICAL LTD·Filed 2013·Granted Aug 12, 2014·27 cites·16 claims
- 0396US8304104B2Battery module having heat dissipation member of novel structure and battery pack employed with the sameLEE JINKYU·Filed 2011·Granted Nov 6, 2012·24 cites·22 claims
- 0495US11688081B2Method of performing simultaneous localization and mapping with respect to a salient object in an imageLG ELECTRONICS INC·Filed 2020·Granted Jun 27, 2023·6 cites·19 claims
- 0595US9614260B2Battery pack of excellent cooling efficiencyLG CHEMICAL LTD·Filed 2013·Granted Apr 4, 2017·16 cites·16 claims
- 0695US9184477B2Battery pack of excellent cooling efficiencyLG CHEMICAL LTD·Filed 2013·Granted Nov 10, 2015·17 cites·12 claims
- 0795US8722224B2Middle or large-sized battery pack of improved cooling efficiencyLEE BUMHYUN·Filed 2011·Granted May 13, 2014·20 cites·19 claims
- 0894US11516930B2Method for manufacturing exterior housing and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·23 claims
- 0993US11983355B2Electronic device comprising flexible display and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 14, 2024·5 cites·20 claims
- 1092US12327824B2Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 1192US12191236B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 7, 2025·2 cites·20 claims
- 1292US11297666B2Electronic device and method for forming Wi-Fi direct group thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·3 cites·18 claims
- 1390US12177629B2Sound generation apparatusLG DISPLAY CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·20 claims
- 1489US12293989B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 1588US12432488B2Active and passive vibration members for outputting soundLG DISPLAY CO LTD·Filed 2023·Granted Sep 30, 2025·1 cites·44 claims
- 1687US12464288B2ApparatusLG DISPLAY CO LTD·Filed 2023·Granted Nov 4, 2025·1 cites·47 claims
- 1786US11561516B2Method for processing data using neural network and electronic device for supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 24, 2023·3 cites·13 claims
- 1885US11605584B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 1985US10674555B2Electronic device and method for forming Wi-Fi direct group thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·4 cites·18 claims
- 2084US11868428B2Apparatus and method with compressed neural network computationSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·2 cites·23 claims
- 2184US8409918B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mountingYANG DAEWOOK·Filed 2010·Granted Apr 2, 2013·9 cites·22 claims
- 2283US11776861B2Compartment shielding with metal frame and capSTATS CHIPPAC PTE LTD·Filed 2021·Granted Oct 3, 2023·1 cites·13 claims
- 2383US10803385B2Device including batteryLG ELECTRONICS INC·Filed 2018·Granted Oct 13, 2020·5 cites·16 claims
- 2483US10750629B2Method for manufacturing exterior housing and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 18, 2020·3 cites·20 claims
- 2583US9281228B2Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor dieCHOI DAESIK·Filed 2011·Granted Mar 8, 2016·7 cites·32 claims
- 2683US8435666B2Battery module with excellent cooling efficiency and compact structure and middle or large-sized battery packLEE JINKYU·Filed 2011·Granted May 7, 2013·3 cites·18 claims
- 2782US11716129B2Method and device for providing differentiated service for each region on basis of beam book informationSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 1, 2023·1 cites·11 claims
- 2882US9093686B2Battery pack of compact structureLG CHEMICAL LTD·Filed 2014·Granted Jul 28, 2015·2 cites·14 claims
- 2981US12349297B2Method for manufacturing exterior housing and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 3081US10658897B2Stator for rotary electric machineLG ELECTRONICS INC·Filed 2017·Granted May 19, 2020·3 cites·20 claims
- 3181US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 3281US8710670B2Integrated circuit packaging system with coupling features and method of manufacture thereofKIM MINJUNG·Filed 2011·Granted Apr 29, 2014·7 cites·20 claims
- 3379US9921267B2Apparatus and method for testing semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 20, 2018·3 cites·20 claims
- 3479US8679900B2Integrated circuit packaging system with heat conduction and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Mar 25, 2014·6 cites·2 claims
- 3578US9735451B2Battery module having temperature sensor and battery pack employed with the sameKIM MINJUNG·Filed 2011·Granted Aug 15, 2017·2 cites·13 claims
- 3678US8999549B2Cooling member of improved cooling efficiency and battery module employed with the sameLG CHEMICAL LTD·Filed 2013·Granted Apr 7, 2015·2 cites·20 claims
- 3778US8710640B2Integrated circuit packaging system with heat slug and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Apr 29, 2014·5 cites·18 claims
- 3877US12237256B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 3977US11805611B2Method for manufacturing exterior housing and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 4077US9971365B2Air conditioner management system comprising a user interface device and a central management device and method for controlling air conditioner by the air conditioner management systemLG ELECTRONICS INC·Filed 2013·Granted May 15, 2018·9 cites·11 claims
- 4176US9274423B2Fluorine-based resins and photosensitive resin composition comprising the sameKIM MINJUNG·Filed 2012·Granted Mar 1, 2016·2 cites·16 claims
- 4275US10470620B2Bathroom management apparatusLG ELECTRONICS INC·Filed 2017·Granted Nov 12, 2019·2 cites·20 claims
- 4375US8679669B2Battery module with excellent cooling efficiency and compact structure and middle or large-sized battery packLG CHEMICAL LTD·Filed 2013·Granted Mar 25, 2014·1 cites·18 claims
- 4475US8372695B2Integrated circuit packaging system with stack interconnect and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 12, 2013·4 cites·10 claims
- 4574US8703535B2Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereofKIM MINJUNG·Filed 2012·Granted Apr 22, 2014·4 cites·18 claims
- 4674US2025105100A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4773US2025167098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4871US11452770B2Recombinant vaccinia virus and use thereofKOLON LIFE SCIENCE INC·Filed 2017·Granted Sep 27, 2022·1 cites·11 claims
- 4971US9134952B2Terminal and control method thereofLG ELECTRONICS INC·Filed 2014·Granted Sep 15, 2015·3 cites·20 claims
- 5071US2025239572A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 155 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →