Inventor · disambiguated record
Min-Ill Kim
Also filed as: KIM MIN · KIM MIN-ILL
4 granted patents·4 pending applications·11 citations·filing 2004–2013
68Inventor score
Top patents by PatentIndex Score
8 records- 0172US7374966B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 20, 2008·5 cites·2 claims
- 0252US7135353B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·5 cites·8 claims
- 0349US8796597B2In-line package apparatuses and methodsKIM MIN-ILL·Filed 2008·Granted Aug 5, 2014·1 cites·22 claims
- 0449US2009134202A1Reflow apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0547US2008191364A1Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0646US2010144137A1Method of interconnecting chips using capillary motionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0735US8905290B2Apparatus for mounting semiconductor chips on a circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 9, 2014·0 cites·13 claims
- 0832US2006105477A1Device and method for manufacturing wafer-level packageLIM SUK-KUN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →