Inventor · disambiguated record
Mika Kiritani
Also filed as: KIRITANI MIKA
8 granted patents·3 pending applications·86 citations·filing 2001–2016
86Inventor score
Top patents by PatentIndex Score
11 records- 0184US7482695B2Stack MCP and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Jan 27, 2009·11 cites·4 claims
- 0281US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 0376US7285864B2Stack MCPTOSHIBA KK·Filed 2004·Granted Oct 23, 2007·20 cites·5 claims
- 0476US6787093B2Semiconductor resin molding methodTOSHIBA KK·Filed 2001·Granted Sep 7, 2004·27 cites·9 claims
- 0569US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 0669US6777313B2Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup timeTOSHIBA KK·Filed 2002·Granted Aug 17, 2004·17 cites·30 claims
- 0758US7833836B2Stack MCP and manufacturing method thereofTOSHIBA KK·Filed 2008·Granted Nov 16, 2010·1 cites·15 claims
- 0852US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
- 0937US2012235282A1Semiconductor device manufacturing method and semiconductor deviceTOMONO AKIRA·Filed 2012·Application pending·0 cites
- 1036US2005026326A1Manufacturing method of semiconductor deviceFiled 2004·Application pending·0 cites
- 1132US2016276312A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →