Inventor · disambiguated record
Min Ji Ko
Also filed as: KO MIN J · KO MIN JI
3 granted patents·9 pending applications·15 citations·filing 2004–2022
66Inventor score
Top patents by PatentIndex Score
12 records- 0182US7567426B2Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded thereinSAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 28, 2009·8 cites·45 claims
- 0264US7994084B2Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Aug 9, 2011·4 cites·12 claims
- 0354US2023114186A1Flexible ultra-thin led skin patch and manufacturing method thereofUNIV KOOKMIN IND ACAD COOP FOUND·Filed 2022·Application pending·0 cites
- 0449US2011064952A1Ceramic substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0548US2011034606A1Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 0647US7531112B2Composition for forming dielectric, capacitor produced using composition, and printed circuit board provided with capacitorSAMSUNG ELECTRO MECH·Filed 2004·Granted May 12, 2009·3 cites·11 claims
- 0747US2009114433A1Multi-layered ceramic board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0846US2009159179A1Method of manufacturing multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0946US2006182973A1Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC propertySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1046US2009114434A1Method of manufacturing non-shrinkage ceramic substrate and non-shrinkage ceramic substrate using the sameSAMSUNG ELECTRO MECHNICS CO LT·Filed 2008·Application pending·0 cites
- 1143US2007087929A1Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1238US2007081297A1Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded thereinSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →