Inventor · disambiguated record
Ming-Yin Ko
Also filed as: KO MING-YIN
2 granted patents·1 pending application·0 citations·filing 2022–2022
24Inventor score
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3 records- 0159US2023402818A1Semiconductor package having ground bonding wire that crosses over signal bonding wire for crosstalk reduction and associated methodAIROHA TECH CORP·Filed 2022·Application pending·0 cites
- 0256US12327806B2Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductanceAIROHA TECH HK LIMITED·Filed 2022·Granted Jun 10, 2025·0 cites·17 claims
- 0354US12278206B2Semiconductor package with conductive adhesive that overflows for return path reduction and associated methodAIROHA TECH HK LIMITED·Filed 2022·Granted Apr 15, 2025·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →