Inventor · disambiguated record
Mika Kobune
Also filed as: KOBUNE MIKA
8 granted patents·7 pending applications·6 citations·filing 2011–2023
76Inventor score
Top patents by PatentIndex Score
15 records- 0189US11810834B2Thermal conduction sheet and heat dissipating device including thermal conduction sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Nov 7, 2023·2 cites·20 claims
- 0286US11545413B2Thermal conduction sheet and heat dissipating device including thermal conduction sheetHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 3, 2023·4 cites·20 claims
- 0368US12183656B2Thermally conductive sheet and method of manufacturing semiconductor deviceRESONAC CORP·Filed 2022·Granted Dec 31, 2024·0 cites·2 claims
- 0468US2025282986A1Heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheetRESONAC CORP·Filed 2022·Application pending·0 cites
- 0563US2025285933A1Heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheetRESONAC CORP·Filed 2023·Application pending·0 cites
- 0659US12441576B2Thermal conduction sheet holder and method of manufacturing heat dissipating deviceRESONAC CORP·Filed 2021·Granted Oct 14, 2025·0 cites·9 claims
- 0754US2015135992A1Resin composition, molded body and composite molded bodyHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 0851US11482466B2Method of manufacturing semiconductor device, thermally conductive sheet, and method of manufacturing thermally conductive sheetSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·9 claims
- 0951US11482467B2Thermally conductive sheet and method of manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·9 claims
- 1051US2025331134A1Liquid heat conduction material, combination of members for producing heat conduction sheet, heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheetRESONAC CORP·Filed 2023·Application pending·0 cites
- 1144US2016215143A1Resin composition, molded body, and production methodHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1243US2012302699A1Resin composition, molded body and composite molded bodyKOBUNE MIKA·Filed 2011·Application pending·0 cites
- 1341US9568061B2Brake pad for yaw control, and brake memberKOBUNE MIKA·Filed 2012·Granted Feb 14, 2017·0 cites·16 claims
- 1441US2023295398A1Thermally conductive sheet and device provided with thermally conductive sheetSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 1535US11639426B2Heat conduction sheet, method of manufacturing heat conduction sheet, and heat dissipating deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted May 2, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →