Inventor · disambiguated record
Mikiko Komiya
Also filed as: KOMIYA Mikiko
1 granted patent·4 pending applications·0 citations·filing 2019–2022
9Inventor score
Files withMITSUI MINING & SMELTING CO LTD5
Top patents by PatentIndex Score
5 records- 0154US11637358B2Carrier-containing metal foil and method for manufacturing millimeter-wave antenna substrate using sameMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Apr 25, 2023·0 cites·11 claims
- 0248US2025065617A1Sheet fixing device, sheet peeling device, and sheet peeling methodMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 0345US2024080990A1Wiring substrate, method of trimming same, and multi-layered wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 0443US2024034670A1Carrier-attached metal foil and method for producing sameMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 0540US2024196530A1Multilayer substrate manufacturing method and wiring substrateMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mikiko Komiya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →