Inventor · disambiguated record
Miho Kurihara
Also filed as: KURIHARA MIHO
2 granted patents·5 pending applications·69 citations·filing 1999–2006
68Inventor score
Files withHITACHI CHEMICAL CO LTD6
Top patents by PatentIndex Score
7 records- 0186US6783434B1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 1999·Granted Aug 31, 2004·61 cites·23 claims
- 0270US7163644B2CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 16, 2007·8 cites·9 claims
- 0352US2006197054A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0452US2006186372A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0550US2005269295A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0643US2004147206A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 0733US2002162386A1Method of measuring concentrations and molecular weights of glue and gelatinFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Miho Kurihara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →