Inventor · disambiguated record
Miki Kurosawa
Also filed as: KUROSAWA MIKI
13 granted patents·2 pending applications·829 citations·filing 1993–2005
94Inventor score
Files withMITSUBISHI ELECTRIC CORP14
Top patents by PatentIndex Score
15 records- 0197US5463202ALaser machining apparatus and methodMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 31, 1995·164 cites·25 claims
- 0296US6875951B2Laser machining deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 5, 2005·135 cites·18 claims
- 0396US6353203B1Laser machining deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Mar 5, 2002·137 cites·33 claims
- 0491US6635849B1Laser beam machine for micro-hole machiningMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 21, 2003·110 cites·7 claims
- 0589US5698120ALaser machining system with control based on machining state recognitionMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 16, 1997·110 cites·13 claims
- 0680US6633376B1Apparatus for inspecting a printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 14, 2003·55 cites·21 claims
- 0779US6972392B2Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 6, 2005·18 cites·3 claims
- 0878US6373026B1Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 16, 2002·17 cites·1 claims
- 0978US5933218ALaser beam machining apparatusMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 3, 1999·39 cites·12 claims
- 1073US6107600ALaser machining apparatusMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 22, 2000·34 cites·18 claims
- 1158US6420676B2Method for machining wiring board with laser beam and device for sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 16, 2002·6 cites·3 claims
- 1249US2005184035A1Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locationsMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1345US6804035B2Laser machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 12, 2004·1 cites·10 claims
- 1432US6201213B1Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined taperingMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 13, 2001·3 cites·1 claims
- 1528US2003146196A1Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardFiled 1996·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →