Inventor · disambiguated record
Min-Keun Kwak
Also filed as: KWAK MIN-KEUN
12 granted patents·4 pending applications·124 citations·filing 2004–2022
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0195US7064435B2Semiconductor package with improved ball land structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 20, 2006·109 cites·18 claims
- 0287US10747123B2Semiconductor device having overlay patternSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·4 cites·20 claims
- 0382US11450614B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 0476US9105694B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 11, 2015·4 cites·15 claims
- 0567US11862570B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 0663US7812265B2Semiconductor package, printed circuit board, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 12, 2010·3 cites·17 claims
- 0752US11923283B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·18 claims
- 0851US2023055921A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0950US11469133B2Bonding apparatus and semiconductor package fabrication equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1047US2009050885A1Semiconductor wafers and methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1146US2009176124A1Bonding pad structure and semiconductor device including the bonding pad structureSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1245US7498193B2Package with barrier wall and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 3, 2009·0 cites·12 claims
- 1345US7166906B2Package with barrier wall and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 23, 2007·3 cites·13 claims
- 1441US2014252640A1Semiconductor package having a multi-channel and a related electronic systemSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1540US7414303B2Lead on chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 19, 2008·0 cites·19 claims
- 1637US10573633B2Semiconductor device including overlay patternsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 25, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →