Inventor · disambiguated record
Ming-Hung Lai
Also filed as: LAI MING-HUNG
2 granted patents·2 citations·filing 2020–2020
35Inventor score
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0176US11099235B1Semiconductor device and method for detecting needle mark shiftingWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 24, 2021·2 cites·10 claims
- 0237US11569150B2Semiconductor bonding pad device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Jan 31, 2023·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →