Inventor · disambiguated record
Ming-Yi Lay
Also filed as: LAY MING-YI
3 granted patents·74 citations·filing 2000–2003
75Inventor score
Top patents by PatentIndex Score
3 records- 0177US6958539B2Metal bump with an insulating sidewall and method of fabricating thereofAU OPTRONICS CORP·Filed 2001·Granted Oct 25, 2005·27 cites·8 claims
- 0276US7041589B2Metal bump with an insulating sidewall and method of fabricating thereofAU OPTRONICS CORP·Filed 2003·Granted May 9, 2006·25 cites·4 claims
- 0376US6489783B1Test device and methodWINBOND ELECTRONICS CORP·Filed 2000·Granted Dec 3, 2002·22 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Ming-Yi Lay files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →