Inventor · disambiguated record
Michael W. Leddige
Also filed as: LEDDIGE MICHAEL · LEDDIGE MICHAEL W · LEDDIGE MICHAEL WILMER
34 granted patents·11 pending applications·1,536 citations·filing 1994–2024
98Inventor score
Top patents by PatentIndex Score
45 records- 0199US6477614B1Method for implementing multiple memory buses on a memory moduleINTEL CORP·Filed 2000·Granted Nov 5, 2002·308 cites·22 claims
- 0298US6587912B2Method and apparatus for implementing multiple memory buses on a memory moduleINTEL CORP·Filed 1998·Granted Jul 1, 2003·407 cites·32 claims
- 0398US6144576AMethod and apparatus for implementing a serial memory architectureINTEL CORP·Filed 1998·Granted Nov 7, 2000·277 cites·19 claims
- 0496US7402048B2Technique for blind-mating daughtercard to mainboardINTEL CORP·Filed 2006·Granted Jul 22, 2008·68 cites·12 claims
- 0590US6366466B1Multi-layer printed circuit board with signal traces of varying widthINTEL CORP·Filed 2000·Granted Apr 2, 2002·50 cites·22 claims
- 0689US6353539B1Method and apparatus for matched length routing of back-to-back package placementINTEL CORP·Filed 1998·Granted Mar 5, 2002·74 cites·21 claims
- 0789US6005776AVertical connector based packaging solution for integrated circuitsINTEL CORP·Filed 1998·Granted Dec 21, 1999·102 cites·15 claims
- 0886US8438515B2Interchangeable connection arrays for double-sided DIMM placementLEDDIGE MICHAEL W·Filed 2011·Granted May 7, 2013·6 cites·9 claims
- 0986US7772708B2Stacking integrated circuit diesINTEL CORP·Filed 2006·Granted Aug 10, 2010·21 cites·6 claims
- 1085US8775991B2Interchangeable connection arrays for double-sided DIMM placementINTEL CORP·Filed 2013·Granted Jul 8, 2014·4 cites·7 claims
- 1177US8099687B2Interchangeable connection arrays for double-sided DIMM placementLEDDIGE MICHAEL W·Filed 2007·Granted Jan 17, 2012·5 cites·14 claims
- 1277US6788222B2Low weight data encoding for minimal power delivery impactINTEL CORP·Filed 2001·Granted Sep 7, 2004·23 cites·20 claims
- 1375US6891899B2System and method for bit encoding to increase data transfer rateINTEL CORP·Filed 2001·Granted May 10, 2005·20 cites·27 claims
- 1474US9910814B2Method, apparatus and system for single-ended communication of transaction layer packetsINTEL CORP·Filed 2015·Granted Mar 6, 2018·2 cites·17 claims
- 1574US7514773B2Systems and arrangements for interconnecting integrated circuit diesINTEL CORP·Filed 2006·Granted Apr 7, 2009·6 cites·14 claims
- 1674US6362973B1Multilayer printed circuit board with placebo vias for controlling interconnect skewINTEL CORP·Filed 2000·Granted Mar 26, 2002·18 cites·14 claims
- 1773US6111205AVia pad geometry supporting uniform transmission line structuresINTEL CORP·Filed 1997·Granted Aug 29, 2000·36 cites·17 claims
- 1871US5513073AOptical device heat spreader and thermal isolation apparatusIBM·Filed 1994·Granted Apr 30, 1996·34 cites·14 claims
- 1962US6708243B1Computer assembly with stub traces coupled to vias to add capacitance at the viasINTEL CORP·Filed 2000·Granted Mar 16, 2004·9 cites·1 claims
- 2060US6724082B2Systems having modules with selectable on die terminationsINTEL CORP·Filed 2001·Granted Apr 20, 2004·8 cites·25 claims
- 2159US8631208B2Providing address range coherency capability to a deviceFANG ZHEN·Filed 2009·Granted Jan 14, 2014·1 cites·20 claims
- 2259US6711640B1Split delay transmission lineINTEL CORP·Filed 2001·Granted Mar 23, 2004·7 cites·1 claims
- 2358US9391378B2High bandwidth connector for internal and external IO interfacesLEDDIGE MICHAEL·Filed 2011·Granted Jul 12, 2016·4 cites·11 claims
- 2457US7194572B2Memory system and method to reduce reflection and signal degradationINTEL CORP·Filed 2003·Granted Mar 20, 2007·9 cites·17 claims
- 2555US6686762B2Memory module using DRAM package to match channel impedanceINTEL CORP·Filed 2000·Granted Feb 3, 2004·8 cites·15 claims
- 2655US6539449B1Capacitively loaded continuity moduleINTEL CORP·Filed 2000·Granted Mar 25, 2003·5 cites·2 claims
- 2754US6515555B2Memory module with parallel stub tracesINTEL CORP·Filed 2000·Granted Feb 4, 2003·8 cites·20 claims
- 2854US2025086370A1Methods and apparatus for crosstalk-based closed-form expression for improved printed circuit board (pcb) designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2954US2008266778A1Memory module routingINTEL CORP·Filed 2008·Application pending·0 cites
- 3053US7133962B2Circulator chain memory command and address bus topologyINTEL CORP·Filed 2003·Granted Nov 7, 2006·7 cites·30 claims
- 3152US6918078B2Systems with modules sharing terminationsINTEL CORP·Filed 2001·Granted Jul 12, 2005·4 cites·22 claims
- 3250US10078612B2Mode selective balanced encoded interconnectINTEL CORP·Filed 2014·Granted Sep 18, 2018·0 cites·24 claims
- 3349US2006139983A1Memory module routingSPRIETSMA JOHN T·Filed 2004·Application pending·0 cites
- 3448US6631083B2Systems with modules and clocking thereforeINTEL CORP·Filed 2001·Granted Oct 7, 2003·5 cites·29 claims
- 3544US9330039B2Crosstalk aware encoding for a data busINTEL CORP·Filed 2012·Granted May 3, 2016·0 cites·24 claims
- 3644US2005195629A1Interchangeable connection arrays for double-sided memory module placementFiled 2004·Application pending·0 cites
- 3743US9632961B2Crosstalk aware decoding for a data busINTEL CORP·Filed 2013·Granted Apr 25, 2017·0 cites·17 claims
- 3842US8649262B2Dynamic configuration of potential links between processing elementsSRINIVASAN SADAGOPAN·Filed 2008·Granted Feb 11, 2014·0 cites·19 claims
- 3942US2003063677A1Multi-level coding for digital communicationINTEL CORP·Filed 2001·Application pending·0 cites
- 4041US2006137903A1Memory module circuit board layer routingSPRIETSMA JOHN T·Filed 2004·Application pending·0 cites
- 4141US2014181358A1Crosstalk aware decoding for a data busSREERAMA CHAITANYA·Filed 2013·Application pending·0 cites
- 4238US2022139843A1Resilient electrical connectors for electromagnetic interference shielding structures in integrated circuit assembliesINTEL CORP·Filed 2019·Application pending·0 cites
- 4337US2004225807A1Method and assembly having a matched filter connectorFiled 2001·Application pending·0 cites
- 4436US2016173055A1Impedance matching in a transmission lineINTEL CORP·Filed 2014·Application pending·0 cites
- 4536US2003056128A1Apparatus and method for a selectable Ron driver impedanceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →