Inventor · disambiguated record
Mi Seon Lee
Also filed as: LEE MI SEON
7 granted patents·3 pending applications·6 citations·filing 2017–2024
76Inventor score
Top patents by PatentIndex Score
10 records- 0194US11823982B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Nov 21, 2023·2 cites·20 claims
- 0292US12046573B2Semiconductor die, a semiconductor die stack, and a semiconductor moduleSK HYNIX INC·Filed 2022·Granted Jul 23, 2024·2 cites·20 claims
- 0391US11594471B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 0484US12463114B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2024·Granted Nov 4, 2025·0 cites·17 claims
- 0582US12327779B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0671US2024332241A1Semiconductor die, a semiconductor die stack, a semiconductor module, and methods of forming the semiconductor die and the semiconductor die stackSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0757US2024395746A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0854US12255126B2Semiconductor devices including substrates bonded to each other and methods for fabricating the sameSK HYNIX INC·Filed 2022·Granted Mar 18, 2025·0 cites·24 claims
- 0950US12391997B2Method for determining the presence or absence of M. tuberculosis, M. bovis and M. bovis BCG in a sampleSEEGENE INC·Filed 2018·Granted Aug 19, 2025·0 cites·10 claims
- 1033US2019076284A1Shoulder braceCOLUMBIA HEALTHCARE CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →