Inventor · disambiguated record
Ming-Han Lee
Also filed as: LEE MING H · LEE MING HAN
138 granted patents·58 pending applications·339 citations·filing 1989–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD170TAIWAN SEMICONDUCTOR MFG9REALTEK SEMICONDUCTOR CORP7LEE MING-HAN2NOVATEK MICROELECTRONICS CORP2
Top patents by PatentIndex Score
196 records- 0198US11854944B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·4 cites·9 claims
- 0298US11749643B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·4 cites·20 claims
- 0398US11201106B2Semiconductor device with conductors embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·7 cites·20 claims
- 0498US9972529B2Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 15, 2018·35 cites·20 claims
- 0598US9613856B1Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·38 cites·20 claims
- 0696US11929326B2Method of forming graphene barrier layer in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0796US11742239B2Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·20 claims
- 0896US9530737B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·15 cites·25 claims
- 0995US11854987B2Semiconductor packages with interconnection features in a seal region and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 1095US11309241B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 1195US11205618B2Graphene barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·8 cites·20 claims
- 1295US10163786B2Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·11 cites·20 claims
- 1394US12094848B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·2 cites·20 claims
- 1494US11901349B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
- 1594US11682616B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 1694US9728485B1Semiconductor device with interconnect structure having catalys layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·10 cites·20 claims
- 1793US10141260B1Interconnection structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·8 cites·20 claims
- 1893US9728503B2Via pre-fill on back-end-of-the-line interconnect layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·9 cites·20 claims
- 1991US11605558B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·2 cites·20 claims
- 2090US12300599B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·1 cites·20 claims
- 2190US11094626B2Methods of forming interconnect structures in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 2289US11094631B2Graphene layer for reduced contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 2389US9490205B2Integrated circuit interconnects and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·6 cites·20 claims
- 2488US9613854B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·6 cites·20 claims
- 2588US9142505B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·9 cites·20 claims
- 2688US7651943B2Forming diffusion barriers by annealing copper alloy layersTAIWAN SEMICONDCUTOR MFG COMPA·Filed 2008·Granted Jan 26, 2010·17 cites·19 claims
- 2788US2025316535A1Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2887US10510657B2Semiconductor device with interconnecting structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·3 cites·20 claims
- 2987US9318439B2Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·6 cites·20 claims
- 3086US10164018B1Semiconductor interconnect structure having graphene-capped metal interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
- 3185US12512404B2Interconnect structure including contact via over barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 3285US11462470B2Method of forming graphene and metallic cap and barrier layers for interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·2 cites·20 claims
- 3385US8013445B2Low resistance high reliability contact via and metal line structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Sep 6, 2011·12 cites·20 claims
- 3484US12362233B2Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3584US12159814B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 3684US11830910B2Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
- 3784US9818644B2Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·3 cites·20 claims
- 3883US12272623B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 3983US11482451B2Interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
- 4083US11081447B2Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·20 claims
- 4183US9640431B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 2, 2017·2 cites·20 claims
- 4283US9269668B2Interconnect having air gaps and polymer wrapped conductive linesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·4 cites·20 claims
- 4383US2024379559A1Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4482US12315811B2Graphene barrier layer for reduced contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 4582US12113021B2Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 4682US9054163B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 9, 2015·3 cites·20 claims
- 4782US2025226292A1Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4881US9721894B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·2 cites·20 claims
- 4981US2025364417A1Semiconductor device including graphene interconnect and method of making the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5081US2025300013A1Interconnect structures having varied materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 196 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Ming-Han Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →