Inventor · disambiguated record
Ming-Yang Li
Also filed as: LI MING · LI MING-YANG
19 granted patents·14 pending applications·30 citations·filing 2011–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16KUO TSUNG-TIEN2TAIWAN HOPAX CHEMICALS MFG CO LTD2TEXAS INSTRUMENTS INC2UNIV BEIJING2
Top patents by PatentIndex Score
33 records- 0196US12046665B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 0295US12174526B2Pellicle for an EUV lithography mask and a method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·3 cites·20 claims
- 0394US11600720B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·20 claims
- 0492US11004965B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·5 cites·20 claims
- 0591US12021019B2Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·2 cites·20 claims
- 0691US11923203B2Semiconductor device and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·1 cites·20 claims
- 0791US11430666B2Semiconductor device and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 30, 2022·5 cites·20 claims
- 0888US11037783B2Field effect transistor using transition metal dichalcogenide and a method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 0987US12369362B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1087US11527659B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 1187US2025323060A1Semiconductor device and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1284US12387944B2Semiconductor device and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1381US2025060663A1Pellicle for an euv lithography mask and a method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US10998452B2Semiconductor device having a lateral semiconductor heterojunction and methodUNIV KING ABDULLAH SCI & TECH·Filed 2018·Granted May 4, 2021·1 cites·14 claims
- 1572US9908356B2Carbonless copy note padTAIWAN HOPAX CHEMICALS MFG CO LTD·Filed 2015·Granted Mar 6, 2018·1 cites·17 claims
- 1671US2024347441A1Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1769US11581185B2Field effect transistor using transition metal dichalcogenide and a method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1868US11329170B2Semiconductor device having a lateral semiconductor heterojunction and methodUNIV KING ABDULLAH SCI & TECH·Filed 2020·Granted May 10, 2022·0 cites·6 claims
- 1961US2023259021A1Pellicle for euv lithography masks and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2060US9536987B2Line-end cutting method for fin structures of FinFETs formed by double patterning technologySHANGHAI IC R & D CENTER CO LTD·Filed 2014·Granted Jan 3, 2017·2 cites·12 claims
- 2157US2023205073A1Pellicle for euv lithography masks and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2255US2022228263A1Independently adjustable flowpath conductance in multi-station semiconductor processingLAM RES CORP·Filed 2020·Application pending·0 cites
- 2354US2023387303A1Method for fabricating vertical channel nanowire transistor with asymmetric stress distributionUNIV BEIJING·Filed 2023·Application pending·0 cites
- 2454US2023387249A1Method for fabricating gate-all-around (gaa) structureUNIV BEIJING·Filed 2023·Application pending·0 cites
- 2553US11464124B2Curved display and method for binding cover glass of curved displayINTERFACE TECH CHENGDU CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·8 claims
- 2651US2023411211A1Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2750US2020215426A1Self-adhesive stacked setTAIWAN HOPAX CHEMICALS MFG CO LTD·Filed 2019·Application pending·0 cites
- 2839US9944108B2Sticky note padKUO TSUNG TIEN·Filed 2011·Granted Apr 17, 2018·0 cites·9 claims
- 2936US2012315421A1Sticky note padKUO TSUNG-TIEN·Filed 2012·Application pending·0 cites
- 3033US9337017B2Method for repairing damages to sidewalls of an ultra-low dielectric constant filmZENG SHAOHAI·Filed 2014·Granted May 10, 2016·0 cites·7 claims
- 3131US2017213897A1Method of fabricating pmos devices with embedded sigeSHANGHAI INTEGRATED CIRCUIT RES AND DEV CENTER CO LTD·Filed 2014·Application pending·0 cites
- 3230US2019053753A1Sleep evaluation display method and device and evaluation equipmentSHENZHEN MEDICA TECH DEVELOPMENT CO LTD·Filed 2015·Application pending·0 cites
- 3323US2016102394A1Method for preparing grounding substrate for semiconductor deviceSHENYANG FORTUNE PREC EQUIPMENT CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →