Inventor · disambiguated record
Ming Li
Also filed as: LI MING · LI MING-XIAN
33 granted patents·18 pending applications·319 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
51 records- 0198US11657868B2Multi-die memory deviceRAMBUS INC·Filed 2021·Granted May 23, 2023·3 cites·20 claims
- 0298US8233303B2Multi-die memory deviceBEST SCOTT C·Filed 2007·Granted Jul 31, 2012·136 cites·41 claims
- 0396US11990177B2Multi-die memory deviceRAMBUS INC·Filed 2023·Granted May 21, 2024·1 cites·20 claims
- 0494US9818470B2Multi-die memory deviceRAMBUS INC·Filed 2016·Granted Nov 14, 2017·7 cites·18 claims
- 0594US9298228B1Memory capacity expansion using a memory riserRAMBUS INC·Filed 2015·Granted Mar 29, 2016·28 cites·17 claims
- 0694US8456934B2DRAM device with built-in self-test circuitryBEST SCOTT C·Filed 2012·Granted Jun 4, 2013·11 cites·24 claims
- 0793US9324411B2Multi-die memory deviceRAMBUS INC·Filed 2015·Granted Apr 26, 2016·6 cites·20 claims
- 0893US8737106B2Multi-die memory deviceBEST SCOTT C·Filed 2012·Granted May 27, 2014·9 cites·27 claims
- 0991US10607691B2Multi-die memory deviceRAMBUS INC·Filed 2018·Granted Mar 31, 2020·5 cites·20 claims
- 1090US10885971B2Multi-die memory deviceRAMBUS INC·Filed 2020·Granted Jan 5, 2021·2 cites·20 claims
- 1190US8193573B2Repairing defects in a nonvolatile semiconductor memory device utilizing a heating elementBRONNER GARY B·Filed 2008·Granted Jun 5, 2012·23 cites·29 claims
- 1289US9082463B2Multi-die memory deviceBEST SCOTT C·Filed 2014·Granted Jul 14, 2015·5 cites·20 claims
- 1389US2024404580A1Multi-die memory deviceRAMBUS INC·Filed 2024·Application pending·0 cites
- 1488US8415788B2System and method for dissipating heat from semiconductor devicesLI MING·Filed 2010·Granted Apr 9, 2013·11 cites·20 claims
- 1587US11195572B2Multi-die memory deviceRAMBUS INC·Filed 2020·Granted Dec 7, 2021·1 cites·20 claims
- 1686US10157660B2Multi-die memory deviceRAMBUS INC·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 1782US6870246B1Method and apparatus for providing an integrated circuit coverRAMBUS INC·Filed 2001·Granted Mar 22, 2005·28 cites·44 claims
- 1881US9466561B2Packaged semiconductor device for high performance memory and logicLI MING·Filed 2010·Granted Oct 11, 2016·6 cites·28 claims
- 1980US8039952B2System and method for dissipating heat from a semiconductor moduleRAMBUS INC·Filed 2009·Granted Oct 18, 2011·8 cites·18 claims
- 2075US9271356B2Backlight module and driving circuitLI MING-XIAN·Filed 2010·Granted Feb 23, 2016·4 cites·11 claims
- 2173US8497544B2Repairing defects in a nonvolatile semiconductor memory module utilizing a heating elementBRONNER GARY B·Filed 2012·Granted Jul 30, 2013·4 cites·28 claims
- 2271US2024222323A1Fan-out stacked package, method of making and electronic device including the stacked packageYIBU SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2371US2024222329A1Stacked package, method of making and electronic device including the stacked packageYIBU SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2467US12087681B2Packaged integrated device with memory buffer integrated circuit die and memory devices on module substrateRAMBUS INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 2567US2023137364A1Packaging techniques for backside mesh connectivityCRYPTOGRAPHY RES INC·Filed 2022·Application pending·0 cites
- 2666US8269711B2LCD device of improvement of flicker upon switching frame rate and method for the sameHSIAO CHUNG-CHIH·Filed 2009·Granted Sep 18, 2012·2 cites·11 claims
- 2766US8063481B2High-speed memory packageLI MING·Filed 2008·Granted Nov 22, 2011·3 cites·28 claims
- 2864US2025219043A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2963US10797108B2Printed reconfigurable electronic circuitHER MAJESTY THE QUEEN IN RIGHT OF CANADA AS REPRESENTED BY THE MINISTER OF INDUSTRY THROUGH THE COMM·Filed 2018·Granted Oct 6, 2020·1 cites·20 claims
- 3063US2025132287A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3162US7538424B2System and method for dissipating heat from a semiconductor moduleRAMBUS INC·Filed 2004·Granted May 26, 2009·9 cites·77 claims
- 3262US2025054821A1Composite carrier, method of making and method of using the composite carrier in semiconductor packagingYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3362US2024363489A1Chip stack and fabrication methodYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3461US2024387500A1Multi-chip package and method of makingYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3559US8120568B2Source driver structure for display and output control circuit thereofLI MING-XIAN·Filed 2009·Granted Feb 21, 2012·2 cites·5 claims
- 3656US11329010B2Integrated circuit shieldCRYPTOGRAPHY RES INC·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 3754US8866558B2Integrated standing-wave voltage controlled oscillator with dual-mode coplanar waveguide resonatorLI MING·Filed 2012·Granted Oct 21, 2014·2 cites·14 claims
- 3854US2025329702A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 3954US2025329700A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 4053US11502047B2Packaging techniques for backside mesh connectivityCRYPTOGRAPHY RES INC·Filed 2018·Granted Nov 15, 2022·0 cites·9 claims
- 4153US7839398B2Gate driving circuit and power control circuitCHUNGHWA PICTURE TUBES LTD·Filed 2007·Granted Nov 23, 2010·0 cites·12 claims
- 4251US11742277B2Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrateRAMBUS INC·Filed 2019·Granted Aug 29, 2023·0 cites·19 claims
- 4349US2008150123A1Semiconductor Package With Rigid And Flexible CircuitsLI MING·Filed 2008·Application pending·0 cites
- 4446US7705445B2Semiconductor package with low and high-speed signal pathsRAMBUS INC·Filed 2005·Granted Apr 27, 2010·0 cites·66 claims
- 4545US2005167806A1Method and apparatus for providing an integrated circuit coverRAMBUS INC·Filed 2005·Application pending·0 cites
- 4645US2013092420A1Embedded multilayer printed circuit board and methodLI MING·Filed 2012·Application pending·0 cites
- 4743US2014313002A1Nonlinear inductorDELTA ELECTRONICS INC·Filed 2013·Application pending·0 cites
- 4839US2006180926A1Heat spreader clamping mechanism for semiconductor modulesRAMBUS INC·Filed 2005·Application pending·0 cites
- 4937US2019006339A1Three-dimensional integrated fan-out wafer level packageASM TECH SINGAPORE PTE LTD·Filed 2017·Application pending·0 cites
- 5033US2006221573A1Heat sink for multiple semiconductor modulesLI MING·Filed 2005·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →