Inventor · disambiguated record
Miao-Cheng Liao
Also filed as: LIAO MIAO-CHENG
14 granted patents·5 pending applications·50 citations·filing 2002–2015
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG6TAIWAN SEMICONDUCTOR MFG CO LTD5LIAO MIAO-CHENG3CHOU YOU-HUA1Hong min hao1
Top patents by PatentIndex Score
19 records- 0186US8518818B2Reverse damascene processCHOU YOU-HUA·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 0282US9536834B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·20 claims
- 0375US9607946B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 28, 2017·3 cites·20 claims
- 0469US6776850B2Preventative maintenance aided tool for CVD chamberTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 17, 2004·16 cites·16 claims
- 0567US9214514B2Mechanisms for forming semiconductor device having stable dislocation profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 15, 2015·2 cites·21 claims
- 0664US6483082B1Heater lift lead screw for vertical furnacesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 19, 2002·12 cites·10 claims
- 0758US9006070B2Two-step shallow trench isolation (STI) processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·0 cites·20 claims
- 0855US9502280B2Two-step shallow trench isolation (STI) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 0953US2015361547A1Method and apparatus for cleaning chemical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 1051US9379275B2Apparatus and method for reducing dark current in image sensorsLIAO MIAO-CHENG·Filed 2012·Granted Jun 28, 2016·0 cites·20 claims
- 1148US8692299B2Two-step shallow trench isolation (STI) processHong min hao·Filed 2012·Granted Apr 8, 2014·0 cites·20 claims
- 1248US7205634B2MIM structure and fabrication process with improved capacitance reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 17, 2007·4 cites·32 claims
- 1343US2010252930A1Method for Improving Performance of Etch Stop LayerTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 1441US2012256324A1Method for Improving Performance of Etch Stop LayerLIAO MIAO-CHENG·Filed 2012·Application pending·0 cites
- 1539US7969708B2Alpha tantalum capacitor plateTAIWAN SEMICONDUCTOR COMPANY LTD·Filed 2007·Granted Jun 28, 2011·0 cites·20 claims
- 1639US7253121B2Method for forming IMD filmsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 7, 2007·0 cites·5 claims
- 1738US8455883B2Stressed semiconductor device and method of manufacturingLIAO MIAO-CHENG·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
- 1838US2005074554A1Method of forming inter-metal dielectric layer structureFiled 2003·Application pending·0 cites
- 1931US2014007905A1Wafer cleaning system and method using electrolytic gas for back-end purgeSUN CHUNG-REN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →