Inventor · disambiguated record
Ming-Ze Lin
Also filed as: LIN MING-ZE
3 granted patents·0 citations·filing 2017–2022
53Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0174US11956897B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 9, 2024·0 cites·18 claims
- 0268US11399429B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 0353US10687419B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 16, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →