Inventor · disambiguated record
Ming-Sheng Liu
Also filed as: LIU MING · LIU MING-SHENG
7 granted patents·3 pending applications·13 citations·filing 2013–2023
76Inventor score
Files withCHIPBOND TECHNOLOGY CORP3UNIV LIVERPOOL3BIG GUNS ENERGY SERVICES INC1INST OF MICROELECTRONICS CAS1UNIV HONG KONG POLYTECHNIC1
Top patents by PatentIndex Score
10 records- 0194US11717803B2Porous materialsUNIV LIVERPOOL·Filed 2020·Granted Aug 8, 2023·4 cites·16 claims
- 0281US10844711B2System and method for triaxial testing of core samples at high temperaturesBIG GUNS ENERGY SERVICES INC·Filed 2018·Granted Nov 24, 2020·6 cites·22 claims
- 0369US8981536B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·6 claims
- 0459US2025031379A1Semiconductor device based on dielectric material containing metal interstitial impurityINST OF MICROELECTRONICS CAS·Filed 2023·Application pending·0 cites
- 0556US12199545B2Phase compensation method of brushless direct current motor and motor system utilizing the sameWELTREND SEMICONDUCTOR INC·Filed 2023·Granted Jan 14, 2025·0 cites·10 claims
- 0653US12214314B2Porous organic cages for quantum sievingUNIV LIVERPOOL·Filed 2021·Granted Feb 4, 2025·0 cites·45 claims
- 0751US10710052B2Porous materialsUNIV LIVERPOOL·Filed 2016·Granted Jul 14, 2020·0 cites·11 claims
- 0841US9000569B2Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Apr 7, 2015·0 cites·7 claims
- 0937US2019214357A1Semiconductor device having a bump structure and method for manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 1031US2018006538A1Electric motorUNIV HONG KONG POLYTECHNIC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →