Inventor · disambiguated record
Min-Horng Liu
Also filed as: LIU MIN-HORNG
0 granted patents·9 pending applications·0 citations·filing 2019–2023
Technology areasH10W
Files withAMULAIRE THERMAL TECH INC9
Top patents by PatentIndex Score
9 records- 0156US2023332848A1Radiator structureAMULAIRE THERMAL TECH INC·Filed 2023·Application pending·0 cites
- 0256US2023235978A1Heat-dissipating substrate with coating structureAMULAIRE THERMAL TECH INC·Filed 2023·Application pending·0 cites
- 0351US2022146216A1Copper-alloy heat-dissipation structure with milled surfaceAMULAIRE THERMAL TECH INC·Filed 2022·Application pending·0 cites
- 0450US2023168049A1Heat-dissipation substrate structure with high adhesive strengthAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0550US2023130677A1Heat-dissipation substrate having gradient sputtered structureAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0649US2023080659A1Radiator structureAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0748US2022304186A1Heat-dissipating substrate with coating structureAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0847US2022307779A1Heat dissipation substrate for increasing solderabilityAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0944US2021180889A1Copper-alloy heat-dissipation structure with milled surfaceAMULAIRE THERMAL TECH INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →