Inventor · disambiguated record
Minglu Liu
Also filed as: LIU MINGLU
2 granted patents·30 pending applications·1 citations·filing 2015–2024
31Inventor score
Top patents by PatentIndex Score
32 records- 0178US11075026B2Magnetic conductive NiFe alloysUNIV ARIZONA STATE·Filed 2019·Granted Jul 27, 2021·1 cites·19 claims
- 0258US2025006611A1Methods and apparatus for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2025006612A1Methods and apparatus for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 0458US2025006665A1Methods and apparatus for stacks of glass layers including deep trench capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0558US2025006610A1Methods and apparatus for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 0658US2025006571A1Methods and apparatus for stacks of glass layers including thin film capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0758US2025006569A1Methods and apparatus for package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 0858US2025006613A1Methods and apparatus for package substrates with stacks of glass layers including interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1057US12400363B2Device and method for improved fiducial marker detectionINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1157US2025006609A1Methods and apparatus for package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 1257US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 1356US2025218959A1Pad design for embedded interconnect bridges in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1456US2025201720A1Methods, systems, apparatus, and articles of manufacture to reduce intermetallic compound formation in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1556US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 1656US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 1755US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 1855US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1955US2025105222A1High performance microelectronic assemblies including through-silicon via bridges with top die last approachINTEL CORP·Filed 2023·Application pending·0 cites
- 2055US2025218988A1Direct bond interconnect architectures for packaging assembliesINTEL CORP·Filed 2023·Application pending·0 cites
- 2153US2024222219A1Package architectures with heterogeneous integration of various device thicknessesINTEL CORP·Filed 2022·Application pending·0 cites
- 2253US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2353US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 2453US2025112162A1Deep cavity metallization and fiducial arrangements for embedded die and assembly thereof on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 2553US2024213164A1Tsv-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (tc-ncf) processINTEL CORP·Filed 2022·Application pending·0 cites
- 2652US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2751US2024186280A1Thermocompression bonding tool for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 2850US2024186279A1In-situ uv cure placement tool for room temperature chip/glass device attachmentINTEL CORP·Filed 2022·Application pending·0 cites
- 2949US2024186251A1Symmetric dummy bridge design for fli alignment improvementINTEL CORP·Filed 2022·Application pending·0 cites
- 3048US2024186281A1Method for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 3146US2024178151A1Overlying fiducial design for glass placement accuracy improvementINTEL CORP·Filed 2022·Application pending·0 cites
- 3231US2016287124A1Electroencephalography (eeg) signal collecting apparatus and vehicle terminal control systemLEAUTO INTELLIGENT TECH (BEIJING) CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →