Inventor · disambiguated record
Michael F. Lofaro
Also filed as: LOFARO MICHAEL · LOFARO MICHAEL F · LOFARO MICHAEL FRANCIS
50 granted patents·4 pending applications·1,162 citations·filing 1995–2021
98Inventor score
Top patents by PatentIndex Score
54 records- 0196US10247700B2Embedded noble metal electrodes in microfluidicsIBM·Filed 2015·Granted Apr 2, 2019·15 cites·9 claims
- 0296US5609517AComposite polishing padIBM·Filed 1995·Granted Mar 11, 1997·160 cites·13 claims
- 0395US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0494US6475072B1Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)IBM·Filed 2000·Granted Nov 5, 2002·86 cites·16 claims
- 0593US9804122B2Embedded noble metal electrodes in microfluidicsIBM·Filed 2015·Granted Oct 31, 2017·5 cites·12 claims
- 0693US6348076B1Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 1999·Granted Feb 19, 2002·147 cites·26 claims
- 0792US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0891US8513127B2Chemical mechanical planarization processes for fabrication of FinFET devicesCHANG JOSEPHINE B·Filed 2011·Granted Aug 20, 2013·10 cites·20 claims
- 0991US5558563AMethod and apparatus for uniform polishing of a substrateIBM·Filed 1995·Granted Sep 24, 1996·97 cites·7 claims
- 1089US8524606B2Chemical mechanical planarization with overburden maskCHARNS LESLIE·Filed 2011·Granted Sep 3, 2013·11 cites·25 claims
- 1189US6812193B2Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 2002·Granted Nov 2, 2004·53 cites·29 claims
- 1287US5558111AApparatus and method for carrier backing film reconditioningIBM·Filed 1995·Granted Sep 24, 1996·41 cites·12 claims
- 1384US9914118B2Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewallsIBM·Filed 2015·Granted Mar 13, 2018·2 cites·10 claims
- 1484US9782773B2Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewallsIBM·Filed 2015·Granted Oct 10, 2017·2 cites·10 claims
- 1583US8263497B2High-yield method of exposing and contacting through-silicon viasANDRY PAUL S·Filed 2009·Granted Sep 11, 2012·11 cites·18 claims
- 1683US7442647B1Structure and method for formation of cladded interconnects for MRAMsIBM·Filed 2008·Granted Oct 28, 2008·11 cites·1 claims
- 1783US6267659B1Stacked polish padIBM·Filed 2000·Granted Jul 31, 2001·27 cites·9 claims
- 1881US6012968AApparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycleIBM·Filed 1998·Granted Jan 11, 2000·46 cites·19 claims
- 1980US10014464B1Combined CMP and RIE contact scheme for MRAM applicationsIBM·Filed 2017·Granted Jul 3, 2018·2 cites·4 claims
- 2079US10170361B2Thin film interconnects with large grainsIBM·Filed 2014·Granted Jan 1, 2019·4 cites·16 claims
- 2177US6325696B1Piezo-actuated CMP carrierIBM·Filed 1999·Granted Dec 4, 2001·50 cites·14 claims
- 2275US8535118B2Multi-spindle chemical mechanical planarization toolCOBB MICHAEL A·Filed 2011·Granted Sep 17, 2013·2 cites·19 claims
- 2375US6199269B1Manipulation of micromechanical objectsIBM·Filed 1997·Granted Mar 13, 2001·41 cites·18 claims
- 2474US10644233B2Combined CMP and RIE contact scheme for MRAM applicationsIBM·Filed 2018·Granted May 5, 2020·1 cites·18 claims
- 2574US8794427B2Multi-generational carrier platformLOFARO MICHAEL F·Filed 2012·Granted Aug 5, 2014·3 cites·18 claims
- 2672US10727121B2Thin film interconnects with large grainsELPIS TECH INC·Filed 2018·Granted Jul 28, 2020·1 cites·10 claims
- 2772US8497210B2Shallow trench isolation chemical mechanical planarizationCHARNS LESLIE·Filed 2011·Granted Jul 30, 2013·2 cites·25 claims
- 2872US8445313B2Method for forming a self-aligned bit line for PCRAM and self-aligned etch back processBREITWISCH MATTHEW J·Filed 2012·Granted May 21, 2013·2 cites·17 claims
- 2972US6030275AVariable control of carrier curvature with direct feedback loopIBM·Filed 1998·Granted Feb 29, 2000·34 cites·23 claims
- 3070US9012329B2Nanogap in-between noble metalsIBM·Filed 2013·Granted Apr 21, 2015·2 cites·20 claims
- 3170US6228744B1Manufacturing methods and uses for micro pipe systemsIBM·Filed 1999·Granted May 8, 2001·31 cites·12 claims
- 3269US7022246B2Method of fabrication of MIMCAP and resistor at same levelIBM·Filed 2003·Granted Apr 4, 2006·16 cites·5 claims
- 3369US6171513B1Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrierIBM·Filed 1999·Granted Jan 9, 2001·30 cites·20 claims
- 3466US8591289B2Multi-spindle chemical mechanical planarization toolCOBB MICHAEL A·Filed 2012·Granted Nov 26, 2013·1 cites·19 claims
- 3566US8273598B2Method for forming a self-aligned bit line for PCRAM and self-aligned etch back processBREITWISCH MATTHEW J·Filed 2011·Granted Sep 25, 2012·1 cites·20 claims
- 3666US5618354AApparatus and method for carrier backing film reconditioningIBM·Filed 1996·Granted Apr 8, 1997·18 cites·5 claims
- 3764US6478665B2Multi-wafer polishing toolIBM·Filed 2001·Granted Nov 12, 2002·7 cites·19 claims
- 3864US6031286ASemiconductor structures containing a micro pipe system thereinIBM·Filed 1997·Granted Feb 29, 2000·25 cites·8 claims
- 3961US7179760B2Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making sameIBM·Filed 2005·Granted Feb 20, 2007·1 cites·15 claims
- 4059US10236443B2Combined CMP and RIE contact scheme for MRAM applicationsIBM·Filed 2017·Granted Mar 19, 2019·0 cites·16 claims
- 4158US2013316623A1Multi-spindle chemical mechanical planarization toolIBM·Filed 2013·Application pending·0 cites
- 4255US6030487AWafer carrier assemblyIBM·Filed 1997·Granted Feb 29, 2000·22 cites·20 claims
- 4354US10944044B2MRAM structure with T-shaped bottom electrode to overcome galvanic effectIBM·Filed 2019·Granted Mar 9, 2021·0 cites·24 claims
- 4454US7955160B2Glass mold polishing method and structureIBM·Filed 2008·Granted Jun 7, 2011·1 cites·23 claims
- 4554US6648979B2Apparatus and method for wafer cleaningIBM·Filed 2001·Granted Nov 18, 2003·6 cites·24 claims
- 4654US2008156636A1Homogeneous Copper Interconnects for BEOLIBM·Filed 2008·Application pending·0 cites
- 4752US8507383B2Fabrication of replacement metal gate devicesANDO TAKASHI·Filed 2011·Granted Aug 13, 2013·0 cites·24 claims
- 4852US6344414B1Chemical-mechanical polishing system having a bi-material wafer backing film assemblyIBM·Filed 1999·Granted Feb 5, 2002·15 cites·20 claims
- 4948US2022277964A1Chemical mechanical planarization slurries and processes for platinum group metalsIBM·Filed 2021·Application pending·0 cites
- 5046US8807318B2Multi-generational carrier platformLOFARO MICHAEL F·Filed 2011·Granted Aug 19, 2014·0 cites·24 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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