Inventor · disambiguated record
Michael C. Loo
Also filed as: LOO MICHAEL · LOO MICHAEL C
1 granted patent·1 pending application·5 citations·filing 2005–2006
26Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0155US7709954B2Redistribution layer for wafer-level chip scale package and method thereforNXP BV·Filed 2006·Granted May 4, 2010·5 cites·20 claims
- 0231US2008251286A1Method For Increasing a Routing Density For a Circuit Board and Such a Circuit BoardKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →