Inventor · disambiguated record
Mike C. Loo
Also filed as: LOO MIKE C
8 granted patents·2 pending applications·997 citations·filing 1993–2001
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0197US5637920AHigh contact density ball grid array package for flip-chipsLSI LOGIC CORP·Filed 1995·Granted Jun 10, 1997·352 cites·19 claims
- 0293US5380956AMulti-chip cooling module and methodSUN MICROSYSTEMS INC·Filed 1993·Granted Jan 10, 1995·156 cites·23 claims
- 0391US5394009ATab semiconductor package with cushioned land grid array outer lead bumpsSUN MICROSYSTEMS INC·Filed 1993·Granted Feb 28, 1995·146 cites·11 claims
- 0489US6118180ASemiconductor die metal layout for flip chip packagingLSI LOGIC CORP·Filed 1997·Granted Sep 12, 2000·121 cites·21 claims
- 0588US5648893AUpgradable multi-chip moduleSUN MICROSYSTEMS INC·Filed 1994·Granted Jul 15, 1997·106 cites·18 claims
- 0681US5648890AUpgradable multi-chip moduleSUN MICROSYSTEMS INC·Filed 1995·Granted Jul 15, 1997·69 cites·10 claims
- 0760US6191483B1Package structure for low cost and ultra thin chip scale packagePHILIPS ELECTRONICS NA·Filed 1999·Granted Feb 20, 2001·27 cites·6 claims
- 0856US5784780AMethod of mounting a flip-chipLSI LOGIC CORP·Filed 1997·Granted Jul 28, 1998·20 cites·2 claims
- 0934US2003031830A1Printed circuit boards and printed circuit board based substrates structures with multiple core layersFiled 2001·Application pending·0 cites
- 1034US2003102159A1Optimum power and ground bump pad and bump patterns for flip chip packagingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →