Inventor · disambiguated record
Ming-Chen Lu
Also filed as: LU MING-CHEN
27 granted patents·2 pending applications·89 citations·filing 2011–2019
94Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR11ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD4YILMAZ HAMZA3ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD2POWERCHIP TECHNOLOGY CORP2
Top patents by PatentIndex Score
29 records- 0194US9653383B2Semiconductor device with thick bottom metal and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted May 16, 2017·15 cites·4 claims
- 0294US8642385B2Wafer level package structure and the fabrication method thereofXUE YAN XUN·Filed 2011·Granted Feb 4, 2014·22 cites·29 claims
- 0390US8952509B1Stacked multi-chip bottom source semiconductor device and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Feb 10, 2015·15 cites·15 claims
- 0487US9054091B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structuresYILMAZ HAMZA·Filed 2013·Granted Jun 9, 2015·6 cites·18 claims
- 0586US9230949B2Method of making stacked multi-chip packaging structureALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jan 5, 2016·4 cites·9 claims
- 0684US9269699B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Feb 23, 2016·6 cites·18 claims
- 0781US9006870B2Stacked multi-chip packaging structure and manufacturing method thereofZHANG XIAOTIAN·Filed 2013·Granted Apr 14, 2015·4 cites·12 claims
- 0878US9171788B1Semiconductor package with small gate clip and assembly methodALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Oct 27, 2015·3 cites·12 claims
- 0977US8669650B2Flip chip semiconductor deviceZHANG XIAOTIAN·Filed 2011·Granted Mar 11, 2014·5 cites·27 claims
- 1072US9245831B1Top-exposed semiconductor package and the manufacturing methodALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2014·Granted Jan 26, 2016·3 cites·7 claims
- 1168US9087828B2Semiconductor device with thick bottom metal and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Jul 21, 2015·2 cites·10 claims
- 1267US9472491B2Semiconductor package with small gate clip and assembly methodALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Oct 18, 2016·1 cites·10 claims
- 1366US9437587B2Flip chip semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 6, 2016·2 cites·19 claims
- 1455US10043736B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structuresALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Aug 7, 2018·0 cites·18 claims
- 1554US9679833B2Semiconductor package with small gate clip and assembly methodALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Jun 13, 2017·0 cites·5 claims
- 1653US9425181B2Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structuresALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Aug 23, 2016·0 cites·16 claims
- 1752US9646920B2Power semiconductor device with small contact footprint and the preparation methodALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2014·Granted May 9, 2017·0 cites·8 claims
- 1851US9006901B2Thin power device and preparation method thereofGONG YUPING·Filed 2013·Granted Apr 14, 2015·0 cites·6 claims
- 1951US8563417B2Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging processLU JUN·Filed 2011·Granted Oct 22, 2013·1 cites·14 claims
- 2049US10504823B2Power semiconductor device with small contact footprint and the preparation methodALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Dec 10, 2019·0 cites·13 claims
- 2147US11062969B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Jul 13, 2021·0 cites·4 claims
- 2247US9854686B2Preparation method of a thin power deviceALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Dec 26, 2017·0 cites·6 claims
- 2347US9685430B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jun 20, 2017·0 cites·4 claims
- 2446US10242926B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2016·Granted Mar 26, 2019·0 cites·19 claims
- 2544US9337131B2Power semiconductor device and the preparation methodALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted May 10, 2016·0 cites·6 claims
- 2641US2014175628A1Copper wire bonding structure in semiconductor device and fabrication method thereofPAN HUA·Filed 2012·Application pending·0 cites
- 2736US9318396B1Method of fabricating flash memoryPOWERCHIP TECHNOLOGY CORP·Filed 2015·Granted Apr 19, 2016·0 cites·14 claims
- 2833US8703545B2Aluminum alloy lead-frame and its use in fabrication of power semiconductor packageNIU ZHIQIANG·Filed 2012·Granted Apr 22, 2014·0 cites·25 claims
- 2932US2018254316A1Manufacturing method of metal-insulator-metal devicePOWERCHIP TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →