Inventor · disambiguated record
Michael Joseph Mcpartlin
Also filed as: MCPARTLIN MICHAEL · MCPARTLIN MICHAEL JOSEPH
28 granted patents·6 pending applications·324 citations·filing 2001–2023
97Inventor score
Files withSKYWORKS SOLUTIONS INC21MCPARTLIN MICHAEL JOSEPH5SIGE SEMICONDUCTOR INC5DOHERTY MARK1NISBET JOHN1
Top patents by PatentIndex Score
34 records- 0197US8729949B2Switching circuitSIGE SEMICONDUCTOR INC·Filed 2013·Granted May 20, 2014·34 cites·20 claims
- 0296US9048284B2Integrated RF front end systemMCPARTLIN MICHAEL JOSEPH·Filed 2012·Granted Jun 2, 2015·36 cites·25 claims
- 0395US9419073B2Integrated RF front end systemSKYWORKS SOLUTIONS INC·Filed 2015·Granted Aug 16, 2016·10 cites·20 claims
- 0494US10069466B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Sep 4, 2018·7 cites·20 claims
- 0594US8451044B2Switching circuitNISBET JOHN·Filed 2009·Granted May 28, 2013·46 cites·16 claims
- 0693US10263072B2Integrated RF front end systemSKYWORKS SOLUTIONS INC·Filed 2017·Granted Apr 16, 2019·6 cites·20 claims
- 0793US10149347B2Front-end integrated circuit for WLAN applicationsSKYWORKS SOLUTIONS INC·Filed 2016·Granted Dec 4, 2018·9 cites·21 claims
- 0893US9818821B2Integrated RF front end systemSKYWORKS SOLUTIONS INC·Filed 2016·Granted Nov 14, 2017·7 cites·23 claims
- 0993US9761700B2Bipolar transistor on high-resistivity substrateMCPARTLIN MICHAEL JOSEPH·Filed 2012·Granted Sep 12, 2017·15 cites·17 claims
- 1092US10522617B2Integrated RF front end systemSKYWORKS SOLUTIONS INC·Filed 2019·Granted Dec 31, 2019·5 cites·20 claims
- 1191US10177716B2Solder bump placement for emitter-ballasting in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 8, 2019·5 cites·18 claims
- 1290US10193504B2Solder bump placement for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 29, 2019·4 cites·20 claims
- 1390US10181824B2Solder bump placement for grounding in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 15, 2019·4 cites·20 claims
- 1490US10103254B2Semiconductor die fabrication methodsSKYWORKS SOLUTIONS INC·Filed 2017·Granted Oct 16, 2018·5 cites·20 claims
- 1589US10447210B2Flip chip amplifier for wireless deviceSKYWORKS SOLUTIONS INC·Filed 2018·Granted Oct 15, 2019·3 cites·20 claims
- 1687US10211197B2Fabrication of radio-frequency devices with amplifier voltage limiting featuresSKYWORKS SOLUTIONS INC·Filed 2017·Granted Feb 19, 2019·4 cites·19 claims
- 1787US9373613B2Amplifier voltage limiting using punch-through effectSKYWORKS SOLUTIONS INC·Filed 2014·Granted Jun 21, 2016·6 cites·15 claims
- 1885US11515845B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 1985US10790788B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2018·Granted Sep 29, 2020·2 cites·19 claims
- 2082US12418265B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2022·Granted Sep 16, 2025·0 cites·22 claims
- 2182US6917243B2Integrated power amplifier circuitSIGE SEMICONDUCTOR INC·Filed 2003·Granted Jul 12, 2005·33 cites·37 claims
- 2282US6825725B1Integrated power amplifier circuitSIGE SEMICONDUCTOR INC·Filed 2003·Granted Nov 30, 2004·32 cites·46 claims
- 2377US6822511B1Integrated power amplifier circuitSIGE SEMICONDUCTOR INC·Filed 2003·Granted Nov 23, 2004·25 cites·75 claims
- 2472US6882220B2Integrated power amplifier circuitSIGE SEMICONDUCTOR INC·Filed 2003·Granted Apr 19, 2005·20 cites·49 claims
- 2568US9768157B2Amplifier voltage limiting in radio-frequency devicesSKYWORKS SOLUTIONS INC·Filed 2016·Granted Sep 19, 2017·1 cites·11 claims
- 2662US2019199294A1Methods for thermal management in amplifiersSKYWORKS SOLUTIONS INC·Filed 2018·Application pending·0 cites
- 2758US2024079314A1Multilayer capacitors with interdigitated fingersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2857US10869362B2WLAN front-endSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 15, 2020·0 cites·18 claims
- 2955US2019131438A1Bipolar transistor on high-resistivity substrateSKYWORKS SOLUTIONS INC·Filed 2018·Application pending·0 cites
- 3049US6424224B1Auxiliary circuitry for monolithic microwave integrated circuitRAYTHEON CO·Filed 2001·Granted Jul 23, 2002·4 cites·10 claims
- 3147US8749032B2Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit pathsDOHERTY MARK·Filed 2009·Granted Jun 10, 2014·0 cites·22 claims
- 3240US2014001602A1Device manufacturing using high-resistivity bulk silicon waferMCPARTLIN MICHAEL JOSEPH·Filed 2012·Application pending·0 cites
- 3340US2014001567A1Fet transistor on high-resistivity substrateMCPARTLIN MICHAEL JOSEPH·Filed 2012·Application pending·0 cites
- 3439US2014001608A1Semiconductor substrate having high and low-resistivity portionsMCPARTLIN MICHAEL JOSEPH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →