Inventor · disambiguated record
Michael Mulzer
Also filed as: MULZER MICHAEL · MULZER MICHAEL F · MULZER MICHAEL FRANZ
4 granted patents·9 pending applications·0 citations·filing 2017–2025
53Inventor score
Top patents by PatentIndex Score
13 records- 0173US12234374B2Polymer compositions and coating solutionsDUPONT ELECTRONICS INC·Filed 2023·Granted Feb 25, 2025·0 cites·12 claims
- 0269US12024640B2UV-curing resin compositions for hard coat applicationsROHM & HAAS ELECT MAT·Filed 2021·Granted Jul 2, 2024·0 cites·5 claims
- 0366US2021115289A1Uv-curing acrylic resin compositions for thermoformable hard coat applicationsROHM & HAAS ELECT MAT·Filed 2020·Application pending·0 cites
- 0462US2025153471A1Multilayer films, polyimide films and coverlay packagesDUPONT ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0559US11084914B2HardcoatROHM & HAAS ELECT MAT·Filed 2018·Granted Aug 10, 2021·0 cites·3 claims
- 0658US2020123408A1Uv-curing acrylic resin compositions for thermoformable hard coat applicationsROHM & HAAS ELECT MAT·Filed 2018·Application pending·0 cites
- 0757US2025299849A1Electrically insulated conductorsDUPONT ELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0855US2021340329A1Curable resin compositions with enhanced shelf lifeROHM & HAAS ELECT MAT·Filed 2021·Application pending·0 cites
- 0955US2024336801A1Electrically insulated wires and cablesDUPONT ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1052US10858541B2Curable compositionROHM & HAAS ELECT MAT·Filed 2018·Granted Dec 8, 2020·0 cites·10 claims
- 1143US2017369654A1Curable resin compositionDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Application pending·0 cites
- 1241US2019112400A1Polymers from bis-arylcyclobutene group containing monomers that cure through other groups and methods for making the sameROHM & HAAS ELECT MAT·Filed 2017·Application pending·0 cites
- 1339US2019185602A1Uv-curing acrylic resin compositions for thermoformable hard coat applicationsROHM & HAAS ELECT MAT·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →